2014581114

Molex
7 NO. Description 1 2 3 A 4 5 6 7 SHELL with DETECTOR(COM/GND) DOCUMENT STATUS FORMAT: master-tb-prod-A3 REVISION: J DATE: 2020/01/14 P1 DETECTOR : GOLD 0.1㎛ MIN on CONTACT(BOTTOM SIDE) OTHER AREAS AND BASE PLATING : NICKEL 1.25㎛ MIN. CONTACT nSIM : GOLD 0.05㎛ MIN. OVER Pd-Ni 0.3㎛ MIN. CONTACT mSD : GOLD 0.05㎛ MIN Pd-Ni 0.2㎛ MIN. SWITCH : GOLD 0.05㎛ MIN Pd-Ni 0.1㎛ MIN. SOLDERS :...
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Внешний вид 2014581114

Технические характеристики

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Тип карт
Расстояние между соседними контактами
Количество контактов
Расположение контактов разъема
Тип монтажа
Особенности microSD and Dual nano-SIM Card Socket, h=2.56mm, Pin-Eject
Размер 22×17.59×2.56 мм
Рабочая температура
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Аналоги 3

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Тип Наименование Корпус Упаковка i Тип Шаг Контакты Расположение Монтаж Исполнение Особенности T раб Примечания Карточка
товара
A- 1042391430 (MOLEX)
 
— 1 шт
 
 — — — microSD Combo, 2.05mm Height, Pull-Lever Eject, SMT, with Detect Switch, 8P microSD Card Type, 6P nano-SIM Card Type
A- 2007660111 (MOLEX)
 
— 1 шт
 
 — — Combo 3-in-2, 1.37mm Height, Pin-Eject Type, 8P microSD Card Type, 6P nano-SIM Card Type, Tray Capable
A- 2010250214 (MOLEX)
 
—
 
 — — Combo 3-in-2, h=1.45mm, Pin-Eject Type, 8P microSD Card Type, 6P nano-SIM Card Type, Tray Capable

Файлы 2

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7 NO. Description 1 2 3 A 4 5 6 7 SHELL with DETECTOR(COM/GND) DOCUMENT STATUS FORMAT: master-tb-prod-A3 REVISION: J DATE: 2020/01/14 P1 DETECTOR : GOLD 0.1㎛ MIN on CONTACT(BOTTOM SIDE) OTHER AREAS AND BASE PLATING : NICKEL 1.25㎛ MIN. CONTACT nSIM : GOLD 0.05㎛ MIN. OVER Pd-Ni 0.3㎛ MIN. CONTACT mSD : GOLD 0.05㎛ MIN Pd-Ni 0.2㎛ MIN. SWITCH : GOLD 0.05㎛ MIN Pd-Ni 0.1㎛ MIN. SOLDERS : GOLD 0.05㎛ MIN. BASE PLATING : NICKEL 1.25㎛ MIN. (Pd-Ni IS PALLADIUM NICKEL) STAINLESS STEEL (S30400) RELEASE DATE 2020/09/29 1.1 ±0.05 E G4 S/W G10 6.35 ±0.08 C5 C6 C3 ± 0.08 �0.15� C7 �1� SIM#1 21.25 G3 D T1 T4 C2 C3 G2�0.15� C7 G9 �0.15� G1 SIM#2 12- �0.61� 6- 0.93 ±0.08 6- 0.67 ±0.08 T5 ~ T8 4- 8.4 ±0.08 11.275 ±0.08 C6 T5 4- 0.4 ±0.05 Pitch 1x3= 3 ±0.08 T2 T3 �0.45� C1 T7 8.16 ±0.08 C5 �0.49� T6 4- 0.4 ±0.05 �0.55� �0.56� �1� 7.8 ±0.08 Pitch 1x3= 3 ±0.08 9.63 ±0.08 G5 �0.8� 0.7 ±0.05 20.31 ±0.08 �20.31� �0.85� �7.8� �9.63� 1 ±0.05 (8.5) 1.75 ±0.08 0.7 ±0.05 �0.4� 1.1 ±0.05 2.38 ±0.08 0.4 ±0.05 No Interference or Insulation Area for mSD contact terminals's working �4.5� G8 NOTES C �6.895� 4- 7.44 ±0.08 1. MATERIALS : SEE TABLE 2. FINISHES : SEE TABLE 3. MATE WITH : microSD Card + nanoSIM(UICC 4FF) Cards 4. PRODUCT SPECIFICATIONS : PS-2014581114-001 5. PACKING SPECIFICATIONS : PS-2014581114-500 6. COPLANARITY OF SOLDER TAILS BEFOR REFLOW : Max 0.08mm 7. COPLANARITY OF SOLDER TAILS AFTER 250°C 2TIMES REFLOW : Max 0.10mm 8. REFERENCE CARD DIMENSIONS ARE WITH STANDARD DIMENSION CARD 9. CUSTOMERS CTF DIMENSIONS ARE EQUAL TO MOLEX MAJOR QUALITY SYMBOL( ) 10. RECOMMENDED METAL MASK IS THICKNESS 0.1mm WITH APERTURE RATIO 150% FOR BETTER SOLDERING. 11. GUARANTEE SPACE 0.2mm OVER THE TOP SURFACE OF THE PRODUCT WHEN MOUNTING ON PCB. 12. THIS DIMENSION CAN ONLY BE MEASURED UNDER SET CONDITIONS(SMT, PCB, CASE). THEREFORE, MEASUREMENT IS NOT POSSIBLE IN THE SOCKET MANUFACTUING, IT IS THE THEORETICAL TOLERANCE USING CAD WHEN TRAY POSITION IS 1.90 (or GAP 0.20). 13. BASICALLY ALL DIMENSIONS ARE MESURED IN THE STATE OF BEFORE SMT, AND THE DIMENSIONS AFFECTED BY THE TRAY FOLLOW THE PERFORMANCE OF THE PRODUCT SPECIFICATIONS AFTER TRAY INSERTION & REMOVAL. Tray Slot at Center �1.77� Tray Slot at Side 1.79 +0.04 -0.12 = BLACK COLOR(UL94V-0) NONE 201458-1114 PART(ORDER) NO. 07:33:57 8 �0.56� G6 1.2 ±0.05 �0.53� B FUNCTIONAL THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION SCALE SYMBOLS DIMENSION UNITS CURRENT REV DESC: STAINLESS STEEL (S30400) LIQUID CRYSTAL POLYMER 9 14.71 ±0.1 Finishes COPPER ALLOY HOUSING UPPER HOUSING LOWER BAR HINGE 14.56 ±0.08 Materials CONTACT UPPER(8P) CONTACT LOWER(12P) with SWITCH �0.15� 0.52 ±0.05 G7 0 ±0.08 �0.42� Dip Length �0.45 +0.05 -0.1 � With Dip 3.01 ±0.1 12.66 ±0.08 SIM Contact from Side 0.52 +0.07 -0.1 SD Contact from Side 1.39 +0.08 -0.14 Socket Height 2.56 +0.1 0 B Gap (0.1) �0.51� Gap 0.1 ±0.06 5.41 ±0.1 C1 ± 0.12 �3.01 ±0.1� �1.37� 1 12- 0.57 ±0.05 1.505 ±0.08 6.35 ±0.08 17.59 6.1 ±0.1 2.025 ±0.1 T8 (13) 14.82 ±0.08 �14.86� ℄ C2 22 ±0.08 Latch Working Area �6.6� � ******* �2.6� Worst Case (Tray 0.2 Pushed) Norminal ( + 0.15 ) ( - 0.1 ) 1 ±0.05 3° �0.59� 0.04 ±0.08 Ejection Stroke �1.9� �0.8� (See Note.12) Bar Stroke �1.6� �3� �1� �0.85� Vacuum Area �⌀ 4.4� #1 #2 #3 #4 #5 #6 #7 #8 mSD Contact �0.79� �3.8� �9.65� �8.16� C °± (2.56 +0.1 0 ) �18� Tray Stopper Gap �0.2� Ke bet ep th afte wee e ga 2- � r Trayn Trayp 0.0 3� M insert and L IN. ion atch -DATE CODEExample: M8B15A1 M-> Molex initial 8-> Year(2018) B-> Month(November) 1, ...9, A, B, C 15-> Date(15th) A-> Site initial(Ansan) 1-> Manufacture line number �21.25� D 16 �0.1� es Tray Position �1.9� Latch Gap 13.32 ±0.06 �1 2 Switch Gap Latch Base 14.62 ±0.1 2- 3 F 16.8 ±0.1 E 4 (0.03MIN.) 1.92 +0.05 -0.1 F 5 6 0 1.87 -0.15 8 Switch Embo 9 Detector Bottom 10 7 6 5 2014581114 MATERIAL NO. 0 = 4 = 0 mm 4:1 GENERAL TOLERANCES (UNLESS SPECIFIED) ANGULAR TOL ± 1.0 ° 4 PLACES ± 0.12 DIVISIONAL 3 PLACES SYMBOLS ± 0.12 2 PLACES ± 0.12 1 PLACE ± 0.15 0 PLACES ± 0.15 DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 4 MSD/NSIM/NSIM 3IN3 SOCKET 2.56H STACKED PIN-EJECT TYPE WITH TRAY, 8P/6P/6P EC NO: 646199 DRWN: ICYANG CHK'D: SHCHU APPR: SHCHU INITIAL REVISION: DRWN: ICYANG APPR: SHCHU THIRD ANGLE PROJECTION 2020/09/29 2020/09/29 2020/09/29 PRODUCT CUSTOMER DRAWING DOC TYPE DOC PART REVISION DOCUMENT NUMBER 2020/08/21 2020/09/29 DRAWING SERIES A3-SIZE 201458 3 2014581114 MATERIAL NUMBER CUSTOMER SEE TABLE PSD GEN A1 SHEET NUMBER 1 OF 5 2 1 A PDF
Документация на 2014581114 

Дата модификации: 05.10.2021

Размер: 895 Кб

5 стр.

PRODUCT SPECIFICATION PRODUCT SPECIFICATION 【1. SCOPE】 This specification defines the performance for the microSD + nano SIM + nano SIM 3in3 Combination Socket Stacked, Pin-Eject Type with Tray series. 【2. PRODUCT NAME AND PART NUMBER】 Part Number Product Name mSD/nSIM 3in3 Stacked Socket, Pin-Eject Type with Tray (with 2 DIP Length 0.45mm) Socket Embossed package 201458-1114 201458-1114 【3. RATINGS】 Item Standard Rated Voltage (MAX.) 10 Volts AC(RMS) or DC Rated Current (MAX.) 0.5 Amps Operating temperature Rating -40°C ～ +85°C *1 Storage temperature Rating -40°C ～ +85°C *1 Relative humidity 10% to 80% R.H *2 *1：Including terminal temperature rise. *2：Storage area is to be free of corrosive gases and dew formation. A1 SHEET 21 REVISE ON PC ONLY REV. A1 RELEASED REV. DESCRIPTION TITLE: PRODUCT SPECIFICATION FOR 3IN3 HORIZONTAL SOCKET THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DESIGN CONTROL STATUS KOR M DOCUMENT NUMBER PS-2014581114-001 WRITTEN BY: IC.YANG APPROVED BY: SH.CHU DATE: YR/MO/DAY 2020/09/02 FILE NAME SHEET PS-2014581114-001.doc 1 OF 21 PDF
Документация на 2014581114 

Дата модификации: 05.10.2021

Размер: 1.27 Мб

21 стр.

    Публикации 1

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