EMIF02-USB03F2

ST Microelectronics
FLIPCHIP/2 LINES EMI FILTERINCLUDING ESD PROTECTION
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EMIF02-USB03F2 2-line IPAD™, EMI filter including ESD protection Datasheet - production data Description The EMIF02-USB03F2 is a highly integrated array designed to suppress EMI / RFI noise for USB OTG (on-the-go) ports. The EMIF02-USB03F2 Flip-Chip packaging means the package size is equal to the die size. Additionally, this filter includes ESD protection circuitry which prevents damage to the protected device when subjected to ESD surges up to 15 kV on external contacts. )OLS&KLSSDFNDJH EXPSV Figure 1. Pin layout (bump side) Features 3 2 • 2-line, low-pass filter + 2-line ESD protection ID Dz Vbus Pup Pd1 B D+ out Pd2 D+ in C Dout GND Din D 1 A • High efficiency in EMI filtering • Lead-free package • Very low PCB space occupation: < 2.80 mm2 • Very thin package: 0.65 mm • High efficiency in ESD suppression (IEC 61000-4-2 level 4) • High reliability offered by monolithic integration Figure 2. Schematic • High reduction of parasitic elements through integration and wafer level packaging Pup Dz ID Vbus EMIF02-USB03F2 R3=1.3kΩ Complies with the following standards • IEC 61000-4-2 level 4 on external pins: – 15 kV (air discharge) – 8 kV (contact discharge) • IEC 61000-4-2 level 1 on internal pins: – 2 kV (air discharge) – 2 kV (contact discharge) D+OUT R2=33Ω D+IN D-OUT R1=33Ω D-IN R5=15kΩ R4=17kΩ Pd2 Pd1 CLINE = 20 pF max. Application ESD protection and EMI filtering for: • USB OTG port September 2015 This is information on a product in full production. TM: IPAD is a trademark of STMicroelectronics. DocID10740 Rev 6 1/8 www.st.com PDF
Документация на EMIF02-USB03F2 

2-line IPAD™, EMI filter including ESD protection

Дата модификации: 16.09.2015

Размер: 241.8 Кб

8 стр.

EMIF02-USB03F2 2-line IPAD™, EMI filter including ESD protection Features ■ 2-line, low-pass filter + 2-line ESD protection ■ High efficiency in EMI filtering ■ Lead-free package ■ Very low PCB space occupation: < 2.80 mm2 ■ Very thin package: 0.65 mm ■ High efficiency in ESD suppression (IEC 61000-4-2 level 4) ■ High reliability offered by monolithic integration ■ High reduction of parasitic elements through integration and wafer level packaging Flip Chip (11 bumps) Figure 1. Pin layout (bump side) 3 2 1 ID Dz IEC 61000-4-2 level 4 on external pins: – 15 kV (air discharge) – 8 kV (contact discharge) Vbus Pup Pd1 B D+ out Pd2 D+ in C IEC 61000-4-2 level 1 on internal pins: – 2 kV (air discharge) – 2 kV (contact discharge) Dout GND Din D A Complies with the following standards ■ ■ Figure 2. Schematic Application Pup Dz ID Vbus EMIF02-USB03F2 R3=1.3kΩ ESD protection and EMI filtering for: ■ USB OTG port D+OUT R2=33Ω D+IN D-OUT R1=33Ω D-IN R5=15kΩ Description R4=17kΩ Pd2 Pd1 The EMIF02-USB03F2 is a highly integrated array designed to suppress EMI / RFI noise for USB OTG (on-the-go) ports. CLINE = 20 pF max. The EMIF02-USB03F2 Flip-Chip packaging means the package size is equal to the die size. Additionally, this filter includes ESD protection circuitry which prevents damage to the protected device when subjected to ESD surges up to 15 kV on external contacts. TM: IPAD is a trademark of STMicroelectronics. February 2010 Doc ID 10740 Rev 5 1/8 www.st.com 8 PDF
Документация на серию EMIF02-USB03F2 

2-line IPAD™, EMI filter including ESD protection

Дата модификации: 08.02.2010

Размер: 187.5 Кб

8 стр.

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