LSM6DS3TR

STMicroelectronics
LSM6DS3 iNEMO inertial module: always-on 3D accelerometer and 3D gyroscope Datasheet - production data Description The LSM6DS3 is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope performing at 1.25 mA (up to 1.6 kHz ODR) in highperformance mode and enabling always-on low-power features for an optimal motion experience for the consumer. LGA-14L (2.5 x 3 x 0.8...
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Технические характеристики

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Корпус LGA14
Рабочие оси
Диапазон измерения ±2, ±4, ±8, ±16 g; ±125/±245/±500/±1000/±2000 deg/sec
Выходной интерфейс
Напряжение питания
Ток потребления
Рабочая температура
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Аналоги 1

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Тип Наименование Корпус Упаковка i Оси Диапазон Выход Напряжение Ток T раб Примечания Карточка
товара
P= LSM6DS3TR-C (ST)
 
— 1 шт
 
 ±2, ±4, ±8, ±16 g; ±125/±245/±500/±1000/±2000 deg/sec — —

Файлы 3

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LSM6DS3 iNEMO inertial module: always-on 3D accelerometer and 3D gyroscope Datasheet - production data Description The LSM6DS3 is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope performing at 1.25 mA (up to 1.6 kHz ODR) in highperformance mode and enabling always-on low-power features for an optimal motion experience for the consumer. LGA-14L (2.5 x 3 x 0.83 mm) typ. Features  Power consumption: 0.9 mA in combo normal mode and 1.25 mA in combo high-performance mode up to 1.6 kHz.  “Always-on” experience with low power consumption for both accelerometer and gyroscope  Smart FIFO up to 8 kbyte based on features set  Compliant with Android K and L  Hard, soft ironing for external magnetic sensor corrections  ±2/±4/±8/±16 g full scale  ±125/±250/±500/±1000/±2000 dps full scale  Analog supply voltage: 1.71 V to 3.6 V  Independent IOs supply (1.62 V)  Compact footprint, 2.5 mm x 3 mm x 0.83 mm  SPI/I2C serial interface with main processor data synchronization feature  Embedded temperature sensor  ECOPACK®, RoHS and “Green” compliant The LSM6DS3 supports main OS requirements, offering real, virtual and batch sensors with 8 kbyte for dynamic data batching. ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes. The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element. The LSM6DS3 has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±250/±500/±1000/±2000 dps. High robustness to mechanical shock makes the LSM6DS3 the preferred choice of system designers for the creation and manufacturing of reliable products. The LSM6DS3 is available in a plastic land grid array (LGA) package. Applications Table 1. Device summary  Pedometer, step detector and step counter  Significant motion and tilt functions  Indoor navigation  Tap and double-tap detection  IoT and connected devices  Intelligent power saving for handheld devices  Vibration monitoring and compensation  Free-fall detection  6D orientation detection August 2017 This is information on a product in full production. Part number Temperature range [°C] LSM6DS3 -40 to +85 LSM6DS3TR -40 to +85 DocID026899 Rev 10 Package LGA-14L (2.5 x 3 x 0.83 mm) Packing Tray Tape & Reel 1/102 www.st.com PDF
Документация на LSM6DS3TR 

Дата модификации: 20.04.2018

Размер: 1.42 Мб

102 стр.

LSM6DS3 iNEMO inertial module: always-on 3D accelerometer and 3D gyroscope Datasheet - production data Description The LSM6DS3 is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope performing at 1.25 mA (up to 1.6 kHz ODR) in highperformance mode and enabling always-on low-power features for an optimal motion experience for the consumer. LGA-14L (2.5 x 3 x 0.83 mm) typ. Features  Power consumption: 0.9 mA in combo normal mode and 1.25 mA in combo high-performance mode up to 1.6 kHz.  “Always-on” experience with low power consumption for both accelerometer and gyroscope  Smart FIFO up to 8 kbyte based on features set  Compliant with Android K and L  Hard, soft ironing for external magnetic sensor corrections  ±2/±4/±8/±16 g full scale  ±125/±250/±500/±1000/±2000 dps full scale  Analog supply voltage: 1.71 V to 3.6 V  Independent IOs supply (1.62 V)  Compact footprint, 2.5 mm x 3 mm x 0.83 mm  SPI/I2C serial interface with main processor data synchronization feature  Embedded temperature sensor  ECOPACK®, RoHS and “Green” compliant The LSM6DS3 supports main OS requirements, offering real, virtual and batch sensors with 8 kbyte for dynamic data batching. ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes. The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element. The LSM6DS3 has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±250/±500/±1000/±2000 dps. High robustness to mechanical shock makes the LSM6DS3 the preferred choice of system designers for the creation and manufacturing of reliable products. The LSM6DS3 is available in a plastic land grid array (LGA) package. Applications Table 1. Device summary  Pedometer, step detector and step counter  Significant motion and tilt functions  Indoor navigation  Tap and double-tap detection  IoT and connected devices  Intelligent power saving for handheld devices  Vibration monitoring and compensation  Free-fall detection  6D orientation detection August 2017 This is information on a product in full production. Part number Temperature range [°C] LSM6DS3 -40 to +85 LSM6DS3TR -40 to +85 DocID026899 Rev 10 Package LGA-14L (2.5 x 3 x 0.83 mm) Packing Tray Tape & Reel 1/102 www.st.com PDF
Документация на LSM6DS3TR 

iNEMO inertial module: always-on 3D accelerometer and 3D gyroscope

Дата модификации: 28.08.2017

Размер: 1.42 Мб

102 стр.

LSM6DS3 iNEMO inertial module: always-on 3D accelerometer and 3D gyroscope Datasheet - production data Description The LSM6DS3 is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope performing at 1.25 mA (up to 1.6 kHz ODR) in highperformance mode and enabling always-on low-power features for an optimal motion experience for the consumer. LGA-14L (2.5 x 3 x 0.83 mm) typ. Features  Power consumption: 0.9 mA in combo normal mode and 1.25 mA in combo high-performance mode up to 1.6 kHz.  “Always-on” experience with low power consumption for both accelerometer and gyroscope  Smart FIFO up to 8 kbyte based on features set  Compliant with Android K and L  Hard, soft ironing for external magnetic sensor corrections  ±2/±4/±8/±16 g full scale  ±125/±245/±500/±1000/±2000 dps full scale  Analog supply voltage: 1.71 V to 3.6 V  Independent IOs supply (1.62 V)  Compact footprint, 2.5 mm x 3 mm x 0.83 mm  SPI/I2C serial interface with main processor data synchronization feature  Embedded temperature sensor  ECOPACK®, RoHS and “Green” compliant The LSM6DS3 supports main OS requirements, offering real, virtual and batch sensors with 8 kbyte for dynamic data batching. ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes. The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element. The LSM6DS3 has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±245/±500/±1000/±2000 dps. High robustness to mechanical shock makes the LSM6DS3 the preferred choice of system designers for the creation and manufacturing of reliable products. The LSM6DS3 is available in a plastic land grid array (LGA) package. Applications Table 1. Device summary  Pedometer, step detector and step counter  Significant motion and tilt functions  Indoor navigation  Tap and double-tap detection  IoT and connected devices  Intelligent power saving for handheld devices  Vibration monitoring and compensation  Free-fall detection  6D orientation detection February 2016 This is information on a product in full production. Part number Temperature range [°C] LSM6DS3 -40 to +85 LSM6DS3TR -40 to +85 DocID026899 Rev 8 Package LGA-14L (2.5 x 3 x 0.83 mm) Packing Tray Tape & Reel 1/100 www.st.com PDF
Документация на серию LSM6DS3 

iNEMO inertial module: always-on 3D accelerometer and 3D gyroscope

Дата модификации: 03.02.2016

Размер: 1.41 Мб

100 стр.

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    H3LIS331DL (ST)