1206SFP250F/32-2

TE Connectivity
Предохранитель плавкий - Ток: 2.5 А; Напряжение: 32 В; Монтаж: SMD, 1206; Примечания: DC Pulse Tolerant Chip Fuse
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Изображение 1206SFP250F/32-2

Технические характеристики

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Номинальный ток
Напряжение AC
Тип монтажа
Примечания
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Аналоги 1

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Тип Наименование Корпус Упаковка i Ток U AC U DC Класс Монтаж I dist. AC I dist. DC Особенности Примечания T раб Одобрение Карточка
товара
A- C1Q 2.5 (BELFUSE)
 
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Файлы 2

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Surface-Mount Fuses – Fundamentals Surface-Mount Fuses Fundamentals Overview TE Circuit Protection offers the widest selection of surface-mount fuses available for addressing a broad range of overcurrent protection applications. Helping to prevent costly damage and promote a safe environment for electronic and electrical equipment, our single-use chip fuses provide performance stability to support applications with current ratings from .5A up to 20A. TE Circuit Protection also offers the telecom FT600 fuse for telecommunications applications. This telecom fuse helps comply with North American overcurrent protection requirements, including Telcordia, GR-1089, TIA-968-A (formerly FCC Part 68), and UL60950 3rd edition. Multi-layer Design for Chip Fuses The multi-layer design has the benefit of exposing more fuse element surface area to the glass-ceramic absorption material. When the fuse elements open, there is more material for the vaporizing fuse metals to absorb into, resulting in a very efficient and effective quenching of the fuse arc. Figure SF1 compares the multi-layer design of our SFF fuses with standard glass coated designs. The glass coated designs rely on the coating on only one side of the fuse element to absorb the vaporizing fuse material when it opens. Therefore, there is much less absorption material available to absorb the fuse metals. The result can be prolonged arcing and possible coating breach. Figure SF2 shows how the absorption characteristics of the two designs differ. The multi-layer design indicates a clean separation with the fuse element evenly diffusing into the surrounding ceramic substrate. In the glass coated design, the element diffusion takes place in a small portion of the device and is only absorbed by the glass material directly above the area of failure. Figure SF1 Glass/Ceramic Substrate Multiple Fuse Elements Multi-layer Design Substrate Material Single Fuse Glass Element Coating Single-layer Glass Coated Design Figure SF2 Fault Zones 10 Multi-layer Design Single-layer Glass Coated Design Wire-In-Air Design for 2410SFV Fuses The 2410(6125) is a Wire-In-Air SMD fuse that is suitable for secondary level overcurrent protection applications. Figure SF3 compares our straight wire element design 2410SFV fuses with normal corrugated wire design fuse. The straight wire element in air provides consistent fusing and cutting characteristics together with inrush current withstanding capability. By introducing PCB assembly technology into the 2410SFV fuse design and manufacturing process, lead-free compliance has been achieved without the problems associated with end caps on traditional ceramic devices. Figure SF3 Glass Fiber Enforced Epoxy Body Straight Wire Element Copper Terminal Plated with Ni and Tin Ceramic Body Corrugated Wire Element End Cap Plated with Tin RoHS Compliant, ELV Compliant 2013_CP_S10-Fuses-1-Fundamentals.indd 107 HF Halogen Free 107 8/3/13 10:58 AM PDF
Документация на серию SFP 

Дата модификации: 15.11.2013

Размер: 2.38 Мб

27 стр.

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