2187799-1

TE Connectivity
Application Specification 114-32029 3.9-mm Pitch 85-Ohm, 92-Ohm and 100-Ohm STRADA Whisper* Connector System O1FEB2021 REV.Y NOTE All numerical values are in metric units [with U.S. customary units in brackets]. Dimensions are in millimeters. Unless other wise specified, dimensions have a tolerance of ±0.13 and angles have a tolerance of ±2°. Figures are not drawn to scale. 1. INTRODUCTION...
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Технические характеристики

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Семейство
Стандарт/Применение
Тип разъема
Количество контактов
Шаг между контактами
Рабочее напряжение контактов
Рабочий ток контактов
Тип монтажа
Расположение контактов разъема
  Примечания: STRADA Whisper 3.9mm, High Speed Backplane Connectors, Board-to-Board, 64 Position, Row-to-Row Spacing 2.5 mm [.098 in], Mating Alignment
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Application Specification 114-32029 3.9-mm Pitch 85-Ohm, 92-Ohm and 100-Ohm STRADA Whisper* Connector System O1FEB2021 REV.Y NOTE All numerical values are in metric units [with U.S. customary units in brackets]. Dimensions are in millimeters. Unless other wise specified, dimensions have a tolerance of ±0.13 and angles have a tolerance of ±2°. Figures are not drawn to scale. 1. INTRODUCTION This specification covers the requirements for application of the 3.9-mm pitch 85-ohm, 92-Ohm and 100-ohm STRADA Whisper connector system. The connector system uses a modular concept and interconnects two printed circuit (pc) boards. The connectors are available in double-end wall (DEW) and open-end (OE) vertical press-fit pin header and right-angle and vertical press-fit receptacle connected to the pc board via eye-ofneedle (EON) compliant pin press-fit contacts. Differential pairs are arranged pair in-row (PiR) or pair in-column (PiC) depending on the application. Available connector sizes are given in Figure 1. When mating, connector alignment features help align contacts prior to engagement of the connectors. For PiR connectors, the header alignment bosses fit into the receptacle alignment slots, which have a guide feature. For PiC connectors, receptacle alignment bosses fit into the pin header alignment slots with a guide feature. In addition, universal guide hardware is available and should be used with the connectors to provide error-free mating and prevent damage to the connector housings and contacts. The female guide module and male guide pin are designed to be installed onto the pc board. These guides are also recommended for multiconnector, large and heavy daughtercard applications, and conditions where the misalignment tolerances cannot be met. The male guide pin is available with internal or external threading. Keyed versions of the guide pin and module are also available Basic terms and features of this product are provided in Figure 1. PiR Connectors DEW Vertical Pin Header (66 Shown) OE Vertical Pin Header (66 Shown) Right-Angle Receptacle (66 Shown) Chicklet Alignment Slot (2 Places) Differential Signal Pair “C” Ground Pin Flat Ground Pin Alignment Boss (2 Places) CONNECTOR SIZE PiR PiC 46 46 63 4 66 66 76 67 78 68 84 0611 86 0612 88 88 96 0810 98 0812 1260 0816 Pin 1 Indicator Mated Assembly Right-Angle Receptacle EON Compliant Pin Press-Fit Contacts STRADA Whisper Connector Guides With Standoff Internal Threaded Male Guide Pin Standoff Female Guide Module DEW Vertical Pin Header (Ref) Figure 1 (Con’td) © 2021 TE Connectivity family of companies All Rights Reserved *Trademark PRODUCT INFORMATION 1-800-522-6752 This controlled document is subject to change. For latest revision and Regional Customer Service, visit our website at www.te.com. TE Connectivity, TE connectivity (logo), and TE (logo) are trademarks. Other logos, product, and/or company names may be trademarks of their respective owners. 1 of 34 PDF
Документация на 2187799-1 

Дата модификации: 09.02.2021

Размер: 7.81 Мб

34 стр.

STRADA WHISPER R 背板连接器 优势 STRADA Whisper 系列产品新增了 • 为升级到 112G 提供了路径 STRADA Whisper R 高速背板连接器，为从 56G PAM-4 升级到 112G • 专为56G PAM-4 背板应用设计 PAM-4 提供了路径，更方便未来数据中心系统升级。最新优化足迹简化了 • 经济高效的解决方案 信号路径路由并实现了112G路径迁移。 应用 STRADA Whisper R 连接器采用相同的插接接口且与现有的STRADA Whisper连接器向后兼容。STRADA Whisper系列产品具有极低的噪声 • 数据中心 和低插损，几乎没有斜切，这一切为系统设计提供了极高的灵活性和宽裕 • 服务器和存储 度。STRADA Whisper R 连接器采用92欧姆阻抗，支持 85 欧姆和 100 欧 • 无线基础设施（如 5G BBU） 姆阻抗系统要求。 • 光传输 STRADA Whisper R 连接器采用全新设计和全自动组装过程，是比较经济高 • 核心路由 效的解决方案。 • 交换机 te.com/products/stradawhisper 数据与终端设备事业部 /// STRADA WHISPER R 背板连接器 PDF
Документация на 2187799-1 

Дата модификации: 07.09.2019

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STRADA WHISPER R BACKPLANE CONNECTORS BENEFITS The newest addition to our STRADA Whisper portfolio, • Upgrade path to 112G STRADA Whisper R high-speed backplane connectors provide an • Design for 56G PAM-4 backplane applications upgrade path from 56G PAM-4 to 112G PAM-4, making future data • Cost effective solution center system upgrades much easier. A newly-optimized footprint simplifies signal path routing and enables a migration path to 112G. APPLICATIONS STRADA Whisper R connectors utilize the same mating interface • Data centers and are backwards compatible with our existing STRADA Whisper • Servers & storage connectors. The STRADA Whisper product family operates with • Wireless infrastructure (e.g., 5G BBU) • Optical transport extremely low noise, low insertion loss and little to no skew—all of which provide system architects with design flexibility and high design margin. With 92 Ohm impedance, STRADA Whisper • Core routing R connectors support both 85 Ohm and 100 Ohm impedance • Switching system requirements. STRADA Whisper R connectors are a more cost effective solution thanks to a new design and a fully automated assembly process. te.com/products/stradawhisper DATA AND DEVICES /// STRADA WHISPER R BACKPLANE CONNECTORS PDF
Документация на 2187799-1 

Дата модификации: 04.09.2019

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Product Specification 108-140186 15AUG2019 REV.A 3.9mm STRADA Whisper R, PIR , 92-Ohm Connector Systems 1. SCOPE 1.1. Content This specification defines performance, tests and quality requirements for the 3.9mm STRADA Whisper R Connector System, that uses a modular concept to interconnect two printed circuit boards. Both receptacle and pin connectors are connected to the printed circuit board with plated thru-hole compliant press-fit leads. 1.2. Qualification When tests are performed on the subject product line, procedures specified in Figure 1 shall be used. All inspections shall be performed using the applicable inspection plan and product drawing. 2. APPLICABLE DOCUMENTS The following documents form a part of this specification to the extent specified herein. Unless otherwise specified, the latest edition of the document applies. In the event of conflict between the requirements of this specification and the product drawing, the product drawing shall take precedence. In the event of conflict between the requirements of this specification and the referenced documents, this specification shall take precedence. 2.1. TE Connectivity (TE) Documents 2.2. Industry Standard  114-32029: Application Specification (3.9mm STRADA Whisper Connector System)  501-134095: Qualification Test Report (3.9mm 92Ω PIR STRADA Whisper R Connector System) EIA-364: Electrical Connector/Socket Test Procedures Including Environmental Classifications 2.3. Reference Document 109-197: Test Specification (TE Test Specifications vs. EIA and IEC Test Methods) 3. REQUIREMENTS 3.1. Design and Construction Product shall be of the design, construction, materials and physical dimensions specified on the applicable product drawing. 3.2.    Ratings Voltage: 80 volts AC maximum peak (⅓ of minimum withstanding voltage) Current: See Figure 2 Temperature: -55 to 105°C © 2019 TE Connectivity family of companies All Rights Reserved | Indicates Change This controlled document is subject to change. 1 of 6 For latest revision and Regional Customer Service, visit our website at www.te.com PRODUCT INFORMATION 1-800-522-6752 *Trademark. TE Connectivity, TE connectivity (logo), and TE (logo) are trademarks. Other logos, product, and/or company names may be trademarks of their respective owners. PDF
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Дата модификации: 19.08.2019

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c-2187799-1

Дата модификации: 23.07.2019

Размер: 415.9 Кб

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4 RELEASED FOR PUBLICATION THIS DRAWING IS UNPUBLISHED. C COPYRIGHT 2011 2 3 2011 LOC GP ALL RIGHTS RESERVED. BY TE CONNECTIVITY D 6 C ( 34.00 ) 5 6 8 9 LTR A DESCRIPTION DATE NEW DRAWING DWN APVD AP 25JUL2018 RP D FINISH: - CONFORMS TO THE REQUIREMENTS OF TE PRODUCT SPECIFICATION 108-32021 BASED ON TELCORDIA GR-1217-CORE FOR SYSTEM QUALITY LEVEL III, APPLICATIONS IN CONTROLLED ENVIRONMENTS (CENTRAL OFFICE). - COMPLIANT PIN AREA: 0.5µm MIN MATTE TIN. 3 SIGNAL PLATED THRU HOLE REQUIREMENTS: FINISHED HOLE = Ø0.34±0.05 HOLE SIZE PRIOR TO PLATING = Ø0.420±0.025 COPPER THICKNESS = 0.025 MIN IMMERSION TIN IF APPLICABLE = 0.00095 REF C 4 GROUND AND SI VIA PLATED THRU HOLE REQUIREMENTS: FINISHED HOLE = Ø0.37±0.05 HOLE SIZE PRIOR TO PLATING = Ø0.450±0.025 COPPER THICKNESS = 0.025 MIN IMMERSION TIN IF APPLICABLE = 0.00095 REF 5 PTH DIMENSIONS APPLY TO THE TOP 1.00mm OF THE PCB THICKNESS FROM THE CONNECTOR MOUNTING SIDE. 6 CONNECTOR MARKED WITH PART NUMBER, DATE CODE, AND "100 OHM" IN APPROXIMATE AREA SHOWN. 7 DATUMS AND BASIC DIMENSIONS ESTABLISHED BY CUSTOMER. 8 APPLIES TO FINISHED HOLE DIAMETER. C B P 2 A B ( 14.90 ) 00 MATERIAL: HOUSING: THERMOPLASTIC, UL 94V-0, BLACK CONTACTS AND SHIELDS: COPPER ALLOY ( 11.50 ) TYP 1112 14 15 17 18 20 21 23 24 REVISIONS DIST 1 D 2 3 1 ( 2.5 ) TYP B ( 3.9 ) TYP POSITION A1 CORNER INDICATOR ( 1.65 ) TYP ( 1.45 ) TYP SIGNAL CONTACT A2 2187799-1 PART NO THIS DRAWING IS A CONTROLLED DOCUMENT. A TOLERANCES UNLESS OTHERWISE SPECIFIED: DIMENSIONS: mm 0 PLC 1 PLC 2 PLC 3 PLC 4 PLC ANGLES MATERIAL FINISH 1 1471-9 (3/11) - - 2 25JUL2018 AJITH .PAI CHK 25JUL2018 AJITH .PAI APVD 25JUL2018 R .PATTERSON DWN TE Connectivity NAME PRODUCT SPEC 108-32021 APPLICATION SPEC - 114-32029 WEIGHT - - CUSTOMER DRAWING SIZE A HEADER ASSEMBLY, 4 PAIR, 8 COLUMN, BACKPLANE, 92 OHM, PAIR-IN-ROW, STRADA WHISPER CAGE CODE A2 00779 RESTRICTED TO DRAWING NO 2187799 SCALE 5:1 SHEET 1 OF - 2 REV A PDF
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Product Specification 108-2351 19 AUG 16 Rev H1 IMPACT 100 Ohm Interconnect Systems 1. SCOPE 1.1. Content This specification defines the performance, tests and quality requirements for the TE Connectivity (TE) IMPACT 100 Ohm Interconnect Systems which consists of modular groupings of broad-edge coupled signals with optional integrated guidance. These connectors are two-piece devices, which connect two printed circuit boards (PCBs). The right angle receptacle connectors (daughtercard) and header pin connectors (backplane) are through-hole devices with Eye-of-the-Needle (EON) compliant pin terminals. 1.2. Qualification When tests are performed on the subject product line, procedures specified in Figure 1 shall be used. All inspections shall be performed using the applicable inspection plan and product drawing. Successful qualification testing on the subject product line was completed on 25 Feb 11. The Qualification Test Report number for this testing is 501-743. This documentation is on file at and available from Engineering Practices and Standards (EPS). 2. APPLICABLE DOCUMENTS The following documents form a part of this specification to the extent specified herein. Unless otherwise specified, the latest edition of the document applies. In the event of conflict between the requirements of this specification and the product drawing, the product drawing shall take precedence. In the event of conflict between the requirements of this specification and the referenced documents, this specification shall take precedence. 2.1. TE Connectivity Document 501-743: IMPACT Interconnect Systems (Qualification Test Report) 2.2. Industry Document EIA-364: Electrical Connector/Socket Test Procedures Including Environmental Classifications 2.3. Reference Document 109-197: TE Test Specifications vs. EIA and IEC Test Methods (Test Specification) 2.4. The header pins are lubricated in the contact area with an approved lubricant according to industry standard Telcordia GR-1217-CORE, Section 5.3. 3. REQUIREMENTS 3.1. Design and Construction Product shall be of the design, construction and physical dimensions specified on the applicable product drawing. IMPACT and Molex are trademarks of Molex, Incorporated © 2016 TE Connectivity family of companies All Rights Reserved | Indicates Change *Trademark. TE Connectivity, TE connectivity (logo), and TE (logo) are trademarks. Other logos, product, and/or company names may be trademarks of their respective owners. 1 of 8 PDF
Документация на 2110186-3 

IMPACT 100 Ohm Interconnect Syatems

Дата модификации: 19.08.2016

Размер: 197.9 Кб

8 стр.

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