Transmitting SPI Signals Over LVDS Interface Reference Design

1 января 2018

This TI Design demonstrates how to resolve and optimize signal integrity challenges typically found when sending SPI signals over longer distance on the same PCB or off PCB to another board in a noisy environment by transmitting SPI signals over LVDS interface. The concept offers high noise immunity, reduced EMI emission, and wider common-mode input tolerance.

Особенности

Noise immunity and range extension for SPI Bus using LVDS interface At least 3 meter communication range using SPI over LVDS vs. 0.5 meter range using standard SPI Techniques to reduce propagation delay and improve SPI communication speed or range by routing SCLK back to SPI master 10x lower power consumption compared to other differential signaling (RS-422/RS-485) solutions –4-V to +5-V common-mode input voltage range offers high ground bounce immunity