PowerSO-20 — корпус ЭК Jedec MO-166

Псевдонимы

PowerSO-20

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Документация

AN668 APPLICATION NOTE A New High Power IC Surface Mount Package Family: PowerSO-20™ & PowerSO-36 Power IC Packaging from Insertion to Surface Mounting by P. Casati & C. Cognetti A new, high power IC surface mount package family is introduced in this note. It is called PowerSO family and has the Jedec registration MO-166. STMicroelectronics developed PowerSO in order to answer the increasing demand of miniaturization and quality in power applications. Automotive, industrial, audio and telecom markets will take advantage of the new package, by introducing the use of Surface Mount Technology in the production of power systems. PowerSO-20 and PowerSO-36 are the elements of the MO-166 family having 20 leads at 0.050 inch pitch (1.27 mm) and 36 leads at 0.026 inch pitch (0.65 mm) respectively. These packages are in mass production since 1995. PowerSO-20 – Jedec Registration MO-166 This note is intended to compare the PowerSO-20/36 with alternative surface mount solutions and to the existing Multiwatt package, the well known "double TO-220" developed by STMicroelectronics in late 70s. Data presented here demonstrates that PowerSO-20 is the real successor of Multiwatt for surface mount applications and is becoming a milestone in power package technology with PowerSO-36 as Multiwatt did 20 years ago. 1. POWER DEVICES AND SURFACE MOUNTING Use of Surface Mount Technology (SMT) has dramatically increased in the last 20 years, moving from consumer to professional applications and serving highly demanding markets like telecom, industrial and automotive. Major advantages expected from SMT are size reduction, automated board mounting, high reliability and cost effectiveness; larger density of functions is achieved in smaller systems. Evolution of SMT drove the development of several new packages for discrete and IC devices: SOT23, SOT194, TO263, SO, PLCC, PQFP with many options in pin pitch, size and thickness. All of them are compatible with the surface mount technique, based on fast picking and placing from tapes or trays, followed by mass soldering. Mounting lines are almost totally automated, with high throughput and high yield. Only a few devices are not yet compatible with SMT principles: a few "exotic" components like large capacitors, resistors, inductors, varistors, etc. and almost all the power semiconductor packages. Several drawbacks are associated with existing power packages: July 2001 1/19

Application Note для корпуса PowerSO-20

A new high power IC surface mount package family: PowerSO-20™ & PowerSO-36 Power IC packaging from insertion to surface mounting

Дата модификации: 27.02.2008

Размер: 598.8 Кб

19 стр.

Характеристики

Тип корпуса:	SOIC
Количество выводов:	20
Шаг выводов:	1.27 мм (50 mils)
Шаг рядов:	14.2 мм (559.1 mils)
Размеры корпуса:	15.9 × 11 × 3.6 мм (626 × 433 × 142 mil)

Особенности

Power

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