Серия RS-232 интерфейсов TD(H)341S232H

Mornsun

Общие характеристики

 Раздел Интерфейс RS-232
Количество передатчиков
Количество приёмников
Максимальная скорость передачи данных
Напряжение питания
Номинальный ток потребления
ESD защита
Рабочая температура

Документация на серию TD(H)341S232H

TD(H)341S232H DFN package isolated RS232 Transceiver Package Features  Ultra-small, ultra-thin, chip scale DFN package  Compliant with TIA/EIA-232 standard  Integrated isolated 3.3V power  I/O power supply range supports 3.3V microprocessors  High isolation to 5000VDC (TD341S232H 3000VDC)  Bus-Pin ESD protection up to 15kV(HBM)  Baud rate up to 120kbps  >25kV/us CMTI  Industrial operating ambient temperature range: -40℃ to +85℃  Meet AEC-Q100 standards  EN62368 approval  Moisture Sensitivity Level (MSL) 3 Applications  Industrial Automation  Building Automation  Smart Electricity Meter Functional Description TD(H)341S232H is a RS232 transceiver with low power consumption and high electrostatic protection and ESD protection, and it is fully compliant with TIA/EIA-232 standards. The main function of the product will be to convert the TTL level to the level of the RS232 protocol to achieve signal isolation. And the product comes with a constant voltage isolation power supply, which can achieve 3000/5000VDC electrical isolation, and can also be easily embedded in user equipment, so that the equipment can easily realize the connection function of the RS232 protocol network. TD(H)341S232H focuses on strengthening the reliability design of TOUT and RIN pins and enhanced ESD design on the basis of traditional IC. Its TOUT and RIN port ESD tolerance is as high as 15kV (Human Body Model). 2023.2.14-A/1 Page 1 of 8 MORNSUN Guangzhou Science & Technology Co., Ltd. reserves the copyright and right of final interpretation PDF
Документация на TD341S232H 

TD(H)341S232H Keywords:

Дата модификации: 05.03.2024

Размер: 2.34 Мб

8 стр.

    Товары серии TD(H)341S232H

    Наименование i Упаковка Особенности
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    		 Ultra-small, ultra-thin, chip-le