Серия защитных диодов 5.0SMDJ33

Taiwan Semiconductor

Общие характеристики

 Раздел Защитные диоды
Корпус DO214AB
Рассеиваемая мощность
Пиковая рассеиваемая мощность
Рабочее напряжение
Напряжение ограничения (диапазон)
Максимальное импульсное напряжение
Ток утечки при рабочем напряжении
Максимальный импульсный ток
Тип супрессора по свойствам
Количество линий ограничения

Документация на серию 5.0SMDJ33

5.0SMDJ16A – 5.0SMDJ100A Taiwan Semiconductor 5000W, 16V - 100V Surface Mount Transient Voltage Suppressor FEATURES ● ● ● ● ● ● ● ● KEY PARAMETERS 5000W peak pulse power capability at 10/1000μs waveform Ideal for automated placement Photo glass passivated chip junction Excellent clamping capability Fast response time: Typically less than 1.0ps Moisture sensitivity level: level 1, per J-STD-020 RoHS Compliant Halogen-free according to IEC 61249-2-21 APPLICATIONS PARAMETER VALUE UNIT VWM VBR (uni-directional) PPPSM 16 - 100 V 17.8 - 123 V 5000 W TJ MAX 175 °C Package DO-214AB (SMC) Configuration Stacked die ● I/O interface ● AC/DC power supply MECHANICAL DATA ● ● ● ● ● ● Case: DO-214AB (SMC) Molding compound meets UL 94V-0 flammability rating Terminal: Matte tin plated leads, solderable per J-STD-002 Meet JESD 201 class 2 whisker test Polarity: Indicated by cathode band Weight: 0.300g (approximately) DO-214AB (SMC) ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted) PARAMETER Non-repetitive peak impulse power dissipation with (1) 10/1000us waveform (2) Steady state power dissipation at T L = 75°C SYMBOL VALUE UNIT PPK 5000 W PD 6.25 W Forward Voltage @ IF = 100A for Uni-directional only VF 5 V Junction temperature TJ -55 to +175 °C Storage temperature TSTG -55 to +175 °C SYMBOL TYP UNIT Junction-to-lead thermal resistance RӨJL 16 °C/W Junction-to-ambient thermal resistance RӨJA 61 °C/W Junction-to-case thermal resistance RӨJC 17 °C/W (3) Notes: 1. Non-repetitive current pulse per Fig.3 and derated above TA = 25°C per Fig.1 2. Units mounted on PCB (16mm x 16mm Cu pad test board) 3. Pulse test with PW = 0.3ms THERMAL PERFORMANCE PARAMETER Thermal Performance Note: Units mounted on PCB (16mm x 16mm Cu pad test board) 1 Version: D2102 PDF
Документация на 5.0SMDJ16A 

Дата модификации: 02.03.2021

Размер: 448.3 Кб

5 стр.

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