CIB10P330NC

Samsung
Chip Bead ; CIB/CIM Series For EMI Suppression Feature •Smallest beads suitable for surface mounting •Perfect shape for automatic mounting, with no directionality. •Excellent solderability and high heat resistance for either flow or reflow soldering. •Monolithic inorganic material construction for high reliability. •Closed magnetic circuit configuration avoids crosstalk and is suitable for hi...
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Технические характеристики

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Импеданс @ 100 МГц (min)
Номинальный ток (max)
Активное сопротивление
Способ монтажа
Рабочая температура
Примечание Ferrite Chip, 1 Function(s), 1A, 2 Pin(s)
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Файлы 1

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Chip Bead ; CIB/CIM Series For EMI Suppression Feature •Smallest beads suitable for surface mounting •Perfect shape for automatic mounting, with no directionality. •Excellent solderability and high heat resistance for either flow or reflow soldering. •Monolithic inorganic material construction for high reliability. •Closed magnetic circuit configuration avoids crosstalk and is suitable for high density PCBs. Application •High frequency EMI prevention application to computers, printers, VCRs, TVs and mobile phones. The CIB/CIM Series are used for EMI suppression filter. These beads suppress electro-magnetic wave noise by increased impedance, especially by increased resistance at noise frequency. CIB Series The CIB Series is composed of mono-layer internal conductor that allows low impedance and low DC resistance. CIM Series The CIM Series display high impedance because it is composed of a multilayered internal conductor and has excellent attenuation characteristics for wide band frequencies. Operating Temp -55~+125℃ -55~+125℃ Storage Temp (After mounting) CIB/CIM Series Dimensions d Ferrite Body External Electrode t W L Unit: mm SIZE CODE L W t d 03 05 10 21 31 32 41 0.6±0.03 1.0±0.05 1.6±0.15 2.0±0.2 3.2±0.2 3.2±0.2 4.5±0.2 0.3±0.03 0.5±0.05 0.8±0.15 1.25±0.2 1.6±0.2 2.5±0.2 1.6±0.2 0.3±0.03 0.5±0.05 0.8±0.15 0.9±0.2 1.1±0.2 1.3±0.2 1.6±0.2 / 1.2±0.2 0.15±0.05 0.25±0.1 0.3±0.2 0.5+ 0.2,-0.3 0.5+ 0.2,-0.3 0.5±0.3 0.5±0.3 Part Numbering (1) Chip Beads (2) B:Mono-layer type, M:Multi-layer type (3) Dimension (4) Material Code (5) Nominal impedance (110:11 ; 121:120 ) (6) Thickness option(N:Standard , A:Thinner than standard , B:Thicker than standard) (7) Packaging(C:paper tape, E:embossed tape) 40 41 PDF
Документация на CIB10P330NC 

Дата модификации: 19.09.2014

Размер: 1.14 Мб

53 стр.

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    GBK201209T-601Y-N (YAG)