LP-ISM110

WAYON
DOCUMENT: M20048 REV LETTER: F PAGE NO: 1 OF2 REV DATE: 2021-06-30 PART NUMBER: LP-ISM110 Polymer PTC Devices Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21-50968309 Fax: 86-21-50968310 Surface mount fuses E-mail: market@way-on.com Http://www.way-on.com Features  Small size of 0805  Lead-free and compliant with the European Union RoHS ...
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Внешний вид серии LP-ISM(L)

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DOCUMENT: M20048 REV LETTER: F PAGE NO: 1 OF2 REV DATE: 2021-06-30 PART NUMBER: LP-ISM110 Polymer PTC Devices Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21-50968309 Fax: 86-21-50968310 Surface mount fuses E-mail: market@way-on.com Http://www.way-on.com Features  Small size of 0805  Lead-free and compliant with the European Union RoHS Directive(EU)2015/863  Fast tripping resettable circuit protection  Surface mount packaging for automated assembly  Agency Recognition: UL、TUV Product Dimensions (mm) A Max. 2.50 Part number LP-ISM110 B Max. 1.60 C Max. 1.30 D Min. 0.20 E Min. 0.10 Part marking 6 Electrical Characteristics IH IT Vmax Imax Ttrip Pd typ Rmin (A) (A) (V) (A) Current(A) Time(S) (W) (Ω) LP-ISM110 1.10 2.20 6.00 40.0 8.00 0.30 0.5 0.05 IH=Hold current: maximum current at which the device will not trip at 25℃ still air. IT=Trip current: minimum current at which the device will always trip at 25℃ still air. Vmax=Maximum voltage device can withstand without damage at rated current. Imax=Maximum fault current device can withstand without damage at rated voltage. Ttrip=Maximum time to trip(s) at assigned current. Pdtyp=Typical power dissipation: typical amount of power dissipated by the device when in state air environment. Rmin=Minimum device resistance at 25℃ prior to tripping. R1max=Maximum device resistance measured in the nontripped state 1 hour post reflow. Part number R1max (Ω) 0.21 Solder Reflow Recommendations C Part number B A B A (mm) 1.20 B (mm) 1.00 C (mm) 1.50 LP-ISM110 * Recommended reflow methods: IR, Vapor phase, hot air oven. * Devices can be cleaned using standard industry methods and solvents. Notes:  If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.  Devices are not designed to be wave soldered to the bottom side of the board. Package Information Tape & Reel: 4000pcs per reel. Effectivity: Reference documents shall be the issue in effect on the date of invitation for bid. Caution: Operation beyond the rated voltage or current may result in rupture electrical arcing or flame. Solder Pad Layouts Specifications are subject to change without notice. page 1 of 2 PDF
Документация на LP-ISM110 

Shang Hai Wayon Thermo-Electro

Дата модификации: 06.07.2022

Размер: 222.1 Кб

2 стр.

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