LP-MSM020/60

DOCUMENT: M20439 REV LETTER: F PAGE NO: 1 OF 2 REV DATE: 2021-06-02 PART NUMBER: LP-MSM020/60 Polymer PTC Devices Wayon Electronics Co., Ltd. No.1001, Shiwan Qi Road, Shanghai 201207,China Tel: 86-21-50968308 Fax: 86-21-50968310 Http://www.way-on.com E-mail: market@way-on.com Surface mount fuses Features Small size of 1812 Lead-free and compliant with the European Union RoHS Directive (E...
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  • Корпус: SMD181245X32MM

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Тип Наименование Корпус Упаковка i Карточка
товара
P= FSMD020-60-R (FUZETEC)
 
SMD181245X32MM в ленте 2000 шт
 

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DOCUMENT: M20439 REV LETTER: F PAGE NO: 1 OF 2 REV DATE: 2021-06-02 PART NUMBER: LP-MSM020/60 Polymer PTC Devices Wayon Electronics Co., Ltd. No.1001, Shiwan Qi Road, Shanghai 201207,China Tel: 86-21-50968308 Fax: 86-21-50968310 Http://www.way-on.com E-mail: market@way-on.com Surface mount fuses Features Small size of 1812 Lead-free and compliant with the European Union RoHS Directive (EU)2015/863 Fast tripping resettable circuit protection Surface mount packaging for automated assembly Agency Recognition: UL Product Dimensions (mm) Part number LP-MSM020/60 A B C D E Max. Max. Max. Min. Min. 4.73 3.41 1.00 0.30 0.30 Part Marking W 020 Electrical Characteristics IH IT Vmax Imax (A) (A) (V) (A) Current(A) 0.20 0.40 60 10 6.0 Part number LP-MSM020/60 Ttrip Pd typ Rmin R1max Time(S) (W) (Ω) (Ω) 0.02 1.0 0.60 6.00 IH=Hold current: maximum current at which the device will not trip at 25℃ still air. IT=Trip current: minimum current at which the device will always trip at 25℃ still air. Vmax=Maximum voltage device can withstand without damage at rated current. Imax=Maximum fault current device can withstand without damage at rated voltage. Ttrip=Maximum time to trip(s) at assigned current. Pdtyp=Typical power dissipation: typical amount of power dissipated by the device when in state air environment. Rmin=Minimum device resistance at 25℃ prior to tripping. R1max=Maximum device resistance measured in the nontripped state 1 hour post reflow. Thermal Derating Maximum ambient operating temperature(℃) LP-MSM020/60 -40 -20 0 20 25 40 50 60 70 80 Hold Current (A) 0.33 0.29 0.26 0.22 0.20 0.17 0.16 0.15 0.13 0.09 Trip Current (A) 0.66 0.58 0.52 0.44 0.40 0.34 0.32 0.30 0.26 0.18 Solder Reflow Recommendations C Solder Pad Layouts Part number LP-MSM020/60 B A B A B C (mm) (mm) (mm) 3.10 1.68 3.20 * Recommended reflow methods: IR, Vapor phase, hot air oven. * Devices can be cleaned using standard industry methods and solvents. Notes:  If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.  Devices are not designed to be wave soldered to the bottom side of the board. Package Information Tape & Reel: 2000pcs per reel. Effectivity: Reference documents shall be the issue in effect on the date of invitation for bid. Specifications are subject to change without notice. Page 1 of 2 PDF
Документация на LP-MSM020/60 

Shang Hai Wayon Thermo-Electro

Дата модификации: 02.06.2021

Размер: 221.7 Кб

2 стр.

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