LP-MSM160/24

WAYON
DOCUMENT: M20215 REV LETTER: C PAGE NO: 1 OF 2 DATE: 2020-02-28 PART NUMBER： Polymer PTC Devices Wayon Electronics Co., Ltd No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21- 50968308 Fax: 86-21-50968310 Surface mount fuses LP-MSM160/24 Http://www.way-on.com E-mail: market@way-on.com Features Small size of 1812 Lead-free and compliant with the European Union RoHS Direc...
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  • Корпус: SMD181245X32MM

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DOCUMENT: M20215 REV LETTER: C PAGE NO: 1 OF 2 DATE: 2020-02-28 PART NUMBER： Polymer PTC Devices Wayon Electronics Co., Ltd No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21- 50968308 Fax: 86-21-50968310 Surface mount fuses LP-MSM160/24 Http://www.way-on.com E-mail: market@way-on.com Features Small size of 1812 Lead-free and compliant with the European Union RoHS Directive 2011/65/EU Fast tripping resettable circuit protection Surface mount packaging for automated assembly Agency Recognition: UL pending Product Dimensions (mm) Part number A B C D E Max. Max. Max. Min. Min. 4.73 3.41 1.70 0.30 0.30 LP-MSM160/24 Prat Marking W 160 Electrical Characteristics IH IT Vmax Imax (A) (A) (V) (A) Current(A) 1.60 3.20 24 40 8.0 Part number LP-MSM160/24 Ttrip Pd typ Rmin R1max Time(S) (W) (Ω) (Ω) 1.00 1.0 0.03 0.10 IH=Hold current: maximum current at which the device will not trip at 25℃ still air. IT=Trip current: minimum current at which the device will always trip at 25℃ still air. Vmax=Maximum voltage device can withstand without damage at rated current. Imax=Maximum fault current device can withstand without damage at rated voltage. Ttrip=Maximum time to trip(s) at assigned current. Pdtyp=Typical power dissipation: typical amount of power dissipated by the device when in state air environment. Rmin=Minimum device resistance at 25℃ prior to tripping. R1max=Maximum device resistance measured in the nontripped state 1 hour post reflow. Thermal Derating Maximum ambient operating temperature(℃) LP-MSM160/24 -40 -20 0 20 25 45 50 60 70 85 Hold Current (A) 2.45 2.15 1.89 1.64 1.60 1.34 1.25 1.15 0.96 0.79 Trip Current (A) 4.90 4.30 3.78 3.28 3.20 2.68 2.50 2.30 1.92 1.58 Solder Reflow Recommendations C Solder Pad Layouts Part number LP-MSM160/24 B A B A B C (mm) (mm) (mm) 3.45 1.78 3.15 * Recommended reflow methods: IR, Vapor phase, and hot air oven. * Devices can be cleaned using standard industry methods and solvents. Notes:  If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.  Devices are not designed to be wave soldered to the bottom side of the board. Package Information Tape & Reel: 1000pcs per reel. Effectivity: Reference documents shall be the issue in effect on the date of invitation for bid. Caution: Operation beyond the rated voltage or current may result in rupture electrical arcing or flame. Specifications are subject to change without notice. Page 1 of 2 PDF
Документация на LP-MSM160/24 

Shang Hai Wayon Thermo-Electro

Дата модификации: 28.02.2020

Размер: 223.7 Кб

2 стр.

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