LP-SM110

DOCUMENT: M20160 REV LETTER: F PAGE NO: 1 OF 2 REV DATE: 2019-09-06 PART NUMBER: Polymer PTC Devices Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21-50968309 Fax: 86-21-50968310 Surface mount fuses LP-SM110 E-mail: market@way-on.com Http://www.way-on.com Features Fast tripping resettable circuit protection Lead-free and compliant with the E...
развернуть ▼ свернуть ▲

Технические характеристики

показать свернуть
Ток удержания
Ток срабатывания
Рабочий ток (max)
Рабочее напряжение (max)
Рабочее сопротивление
Время срабатывания
Корпус
Нашли ошибку? Выделите её курсором и нажмите CTRL + ENTER

Файлы 1

показать свернуть
DOCUMENT: M20160 REV LETTER: F PAGE NO: 1 OF 2 REV DATE: 2019-09-06 PART NUMBER: Polymer PTC Devices Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21-50968309 Fax: 86-21-50968310 Surface mount fuses LP-SM110 E-mail: market@way-on.com Http://www.way-on.com Features Fast tripping resettable circuit protection Lead-free and compliant with the European Union RoHS Directive 2011/65/EU Surface mount packaging for automated assembly Agency Recognition: UL、TUV Product Dimensions (mm) Part number A B C D Max. Max. Max. Min. 7.98 3.18 5.44 0.50 LP-SM110 Part marking 110 Electrical Characteristics Part number LP-SM110 IH IT Vmax Imax Pd typ Rmin R1max (A) (A) (V) (A) Current(A) Ttrip Time(S) (W) (Ω) (Ω) 1.10 2.20 33 40 8.0 0.50 1.9 0.100 0.480 IH=Hold current: maximum current at which the device will not trip at 25℃ still air. IT=Trip current: minimum current at which the device will always trip at 25℃ still air. Vmax=Maximum voltage device can withstand without damage at rated current. Imax=Maximum fault current device can withstand without damage at rated voltage. Ttrip=Maximum time to trip(s) at assigned current. Pdtyp=Typical power dissipation: typical amount of power dissipated by the device when in state air environment. Rmin=Minimum device resistance at 25℃ prior to tripping. R1max=Maximum device resistance measured in the nontripped state 1 hour post reflow. Solder Reflow Recommendations C Solder Pad Layouts Part number LP-SM110 B A B A B C (mm) (mm) (mm) 3.10 2.30 9.70 * Recommended reflow methods: IR, Vapor phase oven, hot air oven solder. * Devices can be cleaned using standard industry methods and solvents. Notes: If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. Package Information Tape & Reel: 2000pcs per reel. Specifications are subject to change without notice. Page 1 of 2 PDF
Документация на LP-SM110 

Shang Hai Wayon Thermo-Electro

Дата модификации: 02.08.2022

Размер: 256.5 Кб

2 стр.

    Внимание! Точность указанного на сайте описания товара не может быть гарантирована. Для получения более полной и точной информации о товаре смотрите техническое описание (Datasheet) на сайте производителя.