ESD5Z5.0T1G

UMW R ESD5Zxx Descriptions The ESD5Zxx Series is designed to protect voltage sensitive components from ESD and transient voltage events. Excellent clamping capability, low leakage, and fast response time, make these parts ideal for ESD protection on designs where board space is at a premium. Because of its small size, it is suited for use in cellular phones, portable devices, digital cameras...
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Технические характеристики

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Пиковая рассеиваемая мощность
Рабочее напряжение
Напряжение ограничения (диапазон)
Максимальное импульсное напряжение
Ток утечки при рабочем напряжении
Максимальный импульсный ток
Тип супрессора по свойствам
Количество линий ограничения
Паразитная емкость перехода
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UMW R ESD5Zxx Descriptions The ESD5Zxx Series is designed to protect voltage sensitive components from ESD and transient voltage events. Excellent clamping capability, low leakage, and fast response time, make these parts ideal for ESD protection on designs where board space is at a premium. Because of its small size, it is suited for use in cellular phones, portable devices, digital cameras, power supplies and many other portable applications. Specification Features: • Low Clamping Voltage • Small Body Outline Dimensions: 1 Cathode 2 Anode MARKING DIAGRAM Mechanical Characteristics: CASE: Void-free, transfer-molded, thermosetting plastic Epoxy Meets UL 94 V−0 0.047″ x 0.032″ (1.20 mm x 0.80 mm) Low Body Height: 0.028″ (0.7 mm) Stand−off Voltage: 2.5 V − 12 V Peak Power up to 240 Watts @ 8 x 20 ms Pulse Low Leakage Response Time is Typically < 1 ns ESD Rating of Class 3 (> 16 kV) per Human Body Model IEC61000−4−2 Level 4 ESD Protection IEC61000−4−4 Level 4 EFT Protection • • • • • • • • • These Devices are Pb−Free and are RoHS Compliant LEAD FINISH: 100% Matte Sn (Tin) MOUNTING POSITION: Any QUALIFIED MAX REFLOW TEMPERATURE: 260°C Device Meets MSL 1 Requirements MAXIMUM RATINGS Rating Symbol Value IEC 61000−4−2 (ESD) Contact Air ±30 ±30 IEC 61000−4−4 (EFT) 40 ESD Voltage Per Human Body Model Per Machine Model 16 400 Total Power Dissipation on FR−4 Board (Note 1) @ TA = 25°C Junction and Storage Temperature Range Lead Solder Temperature − Maximum (10 Second Duration) Unit kV A kV V °PD° 500 mW TJ, Tstg −55 to +150 °C TL 260 °C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. FR−4 printed circuit board, single−sided copper, mounting pad 1 cm2. www.umw-ic.com 1 UTD Semiconductor Co.,Limited PDF
Документация на ESD5Z5.0T1G 

UMW ESD5Z5.0T1G

Дата модификации: 12.10.2022

Размер: 271.5 Кб

5 стр.

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