Серия стабилитронов 1PGSMB5929

Taiwan Semiconductor

Общие характеристики

 Раздел Стабилитроны
Напряжение стабилизации
Ток стабилизации (макс)
Импеданс (макс)
Корпус DO-214AA DO-214AA (SMB)

Документация на серию 1PGSMB5929

1PGSMB5926 – 1PGSMB5956 Taiwan Semiconductor 3W, 11V - 200V Surface Mount Zener Diode FEATURES ● ● ● ● ● ● KEY PARAMETERS Photo Glass passivated chip junction Ideal for automated placement Low inductance Moisture sensitivity level: level 1, per J-STD-020 RoHS Compliant Halogen-free according to IEC 61249-2-21 PARAMETER VALUE UNIT VZ 11 - 200 V Test current IZT 1.9 - 34.1 mA Ptot 3 W TJ MAX 175 °C Package DO-214AA (SMB) Configuration Single die APPLICATIONS ● ● ● ● Switching mode power supply (SMPS) Adapters Lighting application On-board DC/DC converter MECHANICAL DATA ● ● ● ● ● ● Case: DO-214AA (SMB) Molding compound meets UL 94V-0 flammability rating Terminal: Matte tin plated leads, solderable per J-STD-002 Meet JESD 201 class 2 whisker test Polarity: Indicated by cathode band Weight: 0.100g (approximately) DO-214AA (SMB) ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted) PARAMETER DC power dissipation at TL=75°C, measure at zero lead length (Note 1) derate above 75°C SYMBOL VALUE UNIT Ptot 3 W TJ -55 to +175 °C TSTG -55 to +175 °C SYMBOL TYP UNIT Junction-to-lead thermal resistance RӨJL 21 °C/W Junction-to-ambient thermal resistance RӨJA 59 °C/W Junction-to-case thermal resistance RӨJC 23 °C/W Junction temperature Storage temperature Notes: 1. Mounted on Cu-Pad size 10mm x 10mm on PCB THERMAL PERFORMANCE PARAMETER Thermal Performance Note: Units mounted on PCB (10mm x 10mm Cu pad test board) 1 Version: C2102 PDF
Документация на 1PGSMB5926 

Дата модификации: 09.03.2021

Размер: 441.8 Кб

6 стр.

    Товары серии 1PGSMB5929

    Наименование i Упаковка T раб
    1PGSMB5929 (TSC)
     
    1PGSMB5929 M4G (TSC)
     
    1PGSMB5929 R5G (TSC)
     
    1PGSMB5929HM4G (TSC)
     
    1PGSMB5929HR5G (TSC)
     
    1PGSMB5929M4G (TSC)
     
    1PGSMB5929R5G (TSC)