IRFL014TRPBF

VBSemi
IRFL014TRPBF www.VBsemi.com N-Channel 60-V (D-S) MOSFET FEATURES PRODUCT SUMMARY VDS (V) 0.076 at VGS = 10 V 60 • Halogen-free ID (A)a RDS(on) (Ω) Qg (Typ.) 4.5 0.085 at VGS = 4.5 V • TrenchFET® Power MOSFET RoHS 10 nC 3.5 COMPLIANT APPLICATIONS • Load Switches for Portable Devices D SOT-223-3 D G G D S S N-Channel MOSFET ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherw...
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Тип Наименование Корпус Упаковка i Карточка
товара
P= IRFL014TRPBF-VB (VBSEMI)
 
— в ленте 2500 шт
 
P= WMT07N06TS (WAYON)
 
SOT-223 в ленте 2500 шт
P= NCE6005AR (NCE)
 
SOT-223 в ленте 2500 шт

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IRFL014TRPBF www.VBsemi.com N-Channel 60-V (D-S) MOSFET FEATURES PRODUCT SUMMARY VDS (V) 0.076 at VGS = 10 V 60 • Halogen-free ID (A)a RDS(on) (Ω) Qg (Typ.) 4.5 0.085 at VGS = 4.5 V • TrenchFET® Power MOSFET RoHS 10 nC 3.5 COMPLIANT APPLICATIONS • Load Switches for Portable Devices D SOT-223-3 D G G D S S N-Channel MOSFET ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted Parameter Drain-Source Voltage Gate-Source Voltage Continuous Drain Current (TJ = 150 °C) Symbol VDS VGS TC = 25 °C TC = 70 °C TA = 25 °C TA = 70 °C Pulsed Drain Current TC = 25 °C TA = 25 °C TC = 25 °C TC = 70 °C Maximum Power Dissipation TA = 25 °C TA = 70 °C Operating Junction and Storage Temperature Range Continuous Source-Drain Diode Current Soldering Recommendations (Peak Temperature)e, f ID IDM IS PD TJ, Tstg Limit 60 ± 20 Unit V 4.5 3.2 a 2.7 2.3 20 3.2 2.1b, c 4.0 3.0 2.5b, c 1.6b, c - 55 to 150 260 A W °C THERMAL RESISTANCE RATINGS Parameter Symbol Maximum Unit Typical t≤5s RthJA 40 50 Maximum Junction-to-Ambienta, c, d °C/W RthJF 15 20 Steady State Maximum Junction-to-Foot (Drain) Notes: a. Package limited, TC = 25 °C. b. Surface Mounted on 1" x 1" FR4 board. c. t = 10 s. d. Maximum under Steady State conditions is 95 °C/W. e. See Reliability Manual for profile. The ChipFET is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection. f. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components. 1 PDF
Документация на IRFL014TRPBF 

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Дата модификации: 08.09.2023

Размер: 557.2 Кб

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