LP-ISML150

WAYON
DOCUMENT: M20306 REV LETTER: I PAGE NO: 1 OF 2 REV DATE: 2019-10-11 PART NUMBER: Polymer PTC Devices Wayon Electronics Co., Ltd No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21-50968308 Fax: 86-21-50968310 Http://www.way-on.com Surface mount fuses E-mail: market@way-on.com LP-ISML150 Features  Small size of 0805  Low resistance  Lead-free and compliant with the E...
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Внешний вид серии LP-ISM(L)

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DOCUMENT: M20306 REV LETTER: I PAGE NO: 1 OF 2 REV DATE: 2019-10-11 PART NUMBER: Polymer PTC Devices Wayon Electronics Co., Ltd No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21-50968308 Fax: 86-21-50968310 Http://www.way-on.com Surface mount fuses E-mail: market@way-on.com LP-ISML150 Features  Small size of 0805  Low resistance  Lead-free and compliant with the European Union RoHS Directive 2011/65/EU  Fast time-to-trip  Agency Recognition: UL、TUV Product Dimensions (mm) A B C D E Typ. Typ. Typ. Typ. Typ. 2.10±0.20 1.40±0.20 0.60±0.20 0.40±0.10 0.20±0.10 Part number LP-ISML150 Part marking 8 Electrical Characteristics IH Part number LP-ISML150 IT Vmax Imax Ttrip Pd typ Rmin R1max (A) (A) (V) (A) Current(A) Time(S) (W) (Ω) (Ω) 1.50 3.00 8 50 8.0 0.5 0.50 0.015 0.065 IH=Hold current: maximum current at which the device will not trip at 25℃ still air. IT=Trip current: minimum current at which the device will always trip at 25℃ still air. Vmax=Maximum voltage device can withstand without damage at rated current. Imax=Maximum fault current device can withstand without damage at rated voltage. Ttrip=Maximum time to trip(s) at assigned current. Pdtyp=Typical power dissipation: typical amount of power dissipated by the device when in state air environment. Rmin=Minimum device resistance at 25℃ prior to tripping. R1max=Maximum device resistance measured in the nontripped state 1 hour post reflow. Thermal Derating Maximum ambient operating temperature(℃) LP-ISML150 -40 -20 0 20 25 40 50 60 70 85 Hold Current (A) 2.01 1.76 1.63 1.53 1.50 1.24 1.11 1.03 0.86 0.60 Trip Current (A) 4.02 3.52 3.26 3.06 3.00 2.48 2.22 2.06 1.72 1.20 Solder Reflow Recommendations C Solder Pad Layouts Part number LP-ISML150 B A B A B C (mm) (mm) (mm) 1.20 1.00 1.50 * Recommended reflow methods: IR, Vapor phase, hot air oven. * Devices can be cleaned using standard industry methods and solvents. Notes:  If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.  Devices are not designed to be wave soldered to the bottom side of the board. Package Information Tape & Reel: 4000pcs per reel. Effectivity: Reference documents shall be the issue in effect on the date of invitation for bid. Caution: Operation beyond the rated voltage or current may result in rupture electrical arcing or flame. Specifications are subject to change without notice Page 1 of 2 PDF
Документация на LP-ISML150 

Shanghai Changyuan Wayon Circuit protection Co., Ltd

Дата модификации: 14.10.2022

Размер: 245.9 Кб

2 стр.

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