LP-MSM014

DOCUMENT: M20085 REV LETTER: G PAGE NO: 1 OF 2 REV DATE: 2019-10-16 PART NUMBER: Polymer PTC Devices Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21- 50968309 Fax: 86-21-50968310 Surface mount fuses E-mail: market@way-on.com LP-MSM014 Http://www.way-on.com Features Small size of 1812 Lead-free and compliant with the European Union RoHS Direc...
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Технические характеристики

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Ток удержания
Ток срабатывания
Рабочий ток (max)
Рабочее напряжение (max)
Рабочее сопротивление
Время срабатывания
Корпус
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Аналоги 2

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Тип Наименование Корпус Упаковка i I удерж. I сраб. I макс U макс R Время Особенности Корпус Примечания T раб Карточка
товара
P= LP-MSM014-2 (WAYON)
 
1 шт
 
P= FSMD014-R (FUZETEC)
 
SMD181245X32MM 30 шт
 

Файлы 1

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DOCUMENT: M20085 REV LETTER: G PAGE NO: 1 OF 2 REV DATE: 2019-10-16 PART NUMBER: Polymer PTC Devices Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21- 50968309 Fax: 86-21-50968310 Surface mount fuses E-mail: market@way-on.com LP-MSM014 Http://www.way-on.com Features Small size of 1812 Lead-free and compliant with the European Union RoHS Directive 2011/65/EU Fast tripping resettable circuit protection Surface mount packaging for automated assembly Agency Recognition: UL、TUV Product Dimensions (mm) Part number LP-MSM014 A B C D E Max. Max. Max. Min. Min. 4.73 3.41 1.00 0.30 0.30 Part Marking W 014 Electrical Characteristics Part number LP-MSM014 IH IT Vmax Imax Ttrip (A) (A) (V) (A) Current(A) 0.14 0.34 60 10 1.5 Pd typ Rmin R1max Time(S) (W) (Ω) (Ω) 0.15 1.0 1.50 6.00 IH=Hold current: maximum current at which the device will not trip at 25℃ still air. IT=Trip current: minimum current at which the device will always trip at 25℃ still air. Vmax=Maximum voltage device can withstand without damage at rated current. Imax=Maximum fault current device can withstand without damage at rated voltage. Ttrip=Maximum time to trip(s) at assigned current. Pdtyp=Typical power dissipation: typical amount of power dissipated by the device when in state air environment. Rmin=Minimum device resistance at 25℃ prior to tripping. R1max=Maximum device resistance measured in the nontripped state 1 hour post reflow. Thermal Derating LP-MSM014 Maximum ambient operating temperature(℃) -40 -20 0 20 25 40 50 60 70 85 Hold Current (A) 0.23 0.20 0.18 0.16 0.14 0.12 0.11 0.10 0.07 0.05 Trip Current (A) 0.48 0.44 0.40 0.36 0.34 0.28 0.26 0.24 0.18 0.12 Solder Reflow Recommendations C Solder Pad Layouts Part number LP-MSM014 B A B A (mm) 3.45 B (mm) 1.78 C (mm) 3.15 * Recommended reflow methods: IR, Vapor phase, hot air oven. * Devices can be cleaned using standard industry methods and solvents. Notes:  If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.  Devices are not designed to be wave soldered to the bottom side of the board. Package Information Tape & Reel: 2000pcs per reel. Effectivity: Reference documents shall be the issue in effect on the date of invitation for bid. Caution: Operation beyond the rated voltage or current may result in rupture electrical arcing or flame. Specifications are subject to change without notice. Specifications are subject to change without notice. Page 1 of 2 PDF
Документация на LP-MSM014 

Shanghai Changyuan Wayon Circuit protection Co., Ltd

Дата модификации: 15.07.2022

Размер: 226.5 Кб

2 стр.

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