LP-MSM050/30

WAYON
DOCUMENT: M20433 REV LETTER: D PAGE NO: 1 OF 2 REV DATE:2019-09-12 PART NUMBER: Polymer PTC Devices Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21-50968309 Fax: 86-21-50968310 Http://www.way-on.com Surface mount fuses E-mail: market@way-on.com LP-MSM050/30 Features Small size of 1812 Lead-free and compliant with the European Union RoHS Dire...
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  • Корпус: SMD181245X32MM

Аналоги 3

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Тип Наименование Корпус Упаковка i Карточка
товара
P= LP-MSM050-2 (WAYON)
 
— в ленте 2000 шт
 
P= LP-MSM050/24 (WAYON)
 
SMD181245X32MM 2000 шт
P= FSMD050-30-R (FUZETEC)
 
SMD181245X32MM в ленте 100 шт
 

Файлы 1

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DOCUMENT: M20433 REV LETTER: D PAGE NO: 1 OF 2 REV DATE:2019-09-12 PART NUMBER: Polymer PTC Devices Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21-50968309 Fax: 86-21-50968310 Http://www.way-on.com Surface mount fuses E-mail: market@way-on.com LP-MSM050/30 Features Small size of 1812 Lead-free and compliant with the European Union RoHS Directive 2011/65/EU Fast tripping resettable circuit protection Surface mount packaging for automated assembly Product Dimensions (mm) A B C D E Typ. Typ. Typ. Typ. Typ. Part marking 4.53±0.20 3.21±0.20 0.75±0.25 0.60±0.30 0.45±0.15 W050 Part number LP-MSM050/30 Electrical Characteristics Part number LP-MSM050/30 IH IT Vmax Imax Ttrip (A) (A) (V) (A) Current(A) 0.50 1.00 30 40 8.0 Pd typ Rmin R1max Time(S) (W) (Ω) (Ω) 0.15 1.0 0.15 1.00 IH=Hold current: maximum current at which the device will not trip at 25℃ still air. IT=Trip current: minimum current at which the device will always trip at 25℃ still air. Vmax=Maximum voltage device can withstand without damage at rated current. Imax=Maximum fault current device can withstand without damage at rated voltage. Ttrip=Maximum time to trip(s) at assigned current. Pdtyp=Typical power dissipation: typical amount of power dissipated by the device when in state air environment. Rmin=Minimum device resistance at 25℃ prior to tripping. R1max=Maximum device resistance measured in the nontripped state 1 hour post reflow. Thermal Derating LP-MSM050/30 -40 0.78 1.56 Hold Current (A) Trip Current (A) -20 0.69 1.38 Maximum ambient operating temperature(℃) 0 20 25 40 50 60 0.59 0.52 0.50 0.48 0.41 0.37 1.18 1.04 1.00 0.96 0.82 0.74 70 0.33 0.66 85 0.23 0.46 Solder Reflow Recommendations C Solder Pad Layouts Part number LP-MSM050/30 B A B A (mm) 3.45 B (mm) 1.78 C (mm) 3.15 * Recommended reflow methods: IR, Vapor phase, hot air oven. * Devices can be cleaned using standard industry methods and solvents. Notes:  If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.  Devices are not designed to be wave soldered to the bottom side of the board. Package Information Tape & Reel: 2000pcs per reel. Effectivity: Reference documents shall be the issue in effect on the date of invitation for bid. Caution: Operation beyond the rated voltage or current may result in rupture electrical arcing or flame. Specifications are subject to change without notice. Page 1 of 2 PDF
Документация на LP-MSM050/30 

Shang Hai Wayon Thermo-Electro

Дата модификации: 10.07.2020

Размер: 212.8 Кб

2 стр.

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