LP-MSM050

WAYON
DOCUMENT: M20126 REV LETTER: G PAGE NO: 1 OF 2 REV DATE: 2019-09-06 PART NUMBER: LP-MSM050 Polymer PTC Devices Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21-50968309 Fax: 86-21-50968310 Http://www.way-on.com Surface mount fuses E-mail: market@way-on.com Features Small size of 1812 Lead-free and compliant with the European Union RoHS Direct...
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Внешний вид серии LP-MSM(L)

Технические характеристики

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Ток удержания
Ток срабатывания
Рабочий ток (max)
Рабочее напряжение (max)
Рабочее сопротивление
Время срабатывания
Корпус
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Аналоги 2

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Тип Наименование Корпус Упаковка i I удерж. I сраб. I макс U макс R Время Особенности Корпус Примечания T раб Карточка
товара
F~ LP-MSM050-2 (WAYON)
 
— 1 шт
 
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F~ MINISMDC050F-2 (LTL/TE)
 
SMD181245X32MM в ленте 2000 шт
 
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Файлы 1

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DOCUMENT: M20126 REV LETTER: G PAGE NO: 1 OF 2 REV DATE: 2019-09-06 PART NUMBER: LP-MSM050 Polymer PTC Devices Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21-50968309 Fax: 86-21-50968310 Http://www.way-on.com Surface mount fuses E-mail: market@way-on.com Features Small size of 1812 Lead-free and compliant with the European Union RoHS Directive 2011/65/EU Fast tripping resettable circuit protection Surface mount packaging for automated assembly Agency Recognition: UL、TUV Product Dimensions (mm) Part number A B C D E Max. Max. Max. Min. Min. Part marking 4.73 3.41 0.83 0.30 0.30 W050 LP-MSM050 Electrical Characteristics Part number IH IT Vmax Imax Ttrip (A) (A) (V) (A) Current(A) LP-MSM050 0.50 1.00 15 40 8.0 Pd typ Rmin R1max Time(S) (W) (Ω) (Ω) 0.15 1.0 0.15 1.00 IH=Hold current: maximum current at which the device will not trip at 25℃ still air. IT=Trip current: minimum current at which the device will always trip at 25℃ still air. Vmax=Maximum voltage device can withstand without damage at rated current. Imax=Maximum fault current device can withstand without damage at rated voltage. Ttrip=Maximum time to trip(s) at assigned current. Pdtyp=Typical power dissipation: typical amount of power dissipated by the device when in state air environment. Rmin=Minimum device resistance at 25℃ prior to tripping. R1max=Maximum device resistance measured in the nontripped state 1 hour post reflow. Thermal Derating Maximum ambient operating temperature(℃) LP-MSM050 -40 0.78 1.56 Hold Current (A) Trip Current (A) -20 0.69 1.38 0 0.59 1.18 20 0.52 1.04 25 0.50 1.00 40 0.48 0.96 50 0.41 0.82 60 0.37 0.74 70 0.33 0.66 85 0.23 0.46 Solder Reflow Recommendations C Solder Pad Layouts B A B A B C (mm) (mm) (mm) LP-MSM050 3.45 1.78 3.15 * Recommended reflow methods: IR, Vapor phase, hot air oven. * Devices can be cleaned using standard industry methods and solvents. Notes:  If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.  Devices are not designed to be wave soldered to the bottom side of the board. Part number Package Information Tape & Reel: 2000pcs per reel. Effectivity: Reference documents shall be the issue in effect on the date of invitation for bid. Caution: Operation beyond the rated voltage or current may result in rupture electrical arcing or flame. Specifications are subject to change without notice. Page 1 of 2 PDF
Документация на LP-MSM050 

Shang Hai Wayon Thermo-Electro

Дата модификации: 10.07.2022

Размер: 223.1 Кб

2 стр.

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    MF-FSMF010X-2 (BOURNS)