LP-MSM125/16

WAYON
DOCUMENT: M20317 REV LETTER: E PAGE NO: 1 OF 2 REV DATE: 2020-09-23 PART NUMBER: Polymer PTC Devices Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21-50968309 Fax: 86-21-50968310 E-mail: market@way-on.com Surface mount fuses LP-MSM125/16 Http://www.way-on.com Features Small size of 1812 Lead-free and compliant with the European Union RoHS Dir...
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DOCUMENT: M20317 REV LETTER: E PAGE NO: 1 OF 2 REV DATE: 2020-09-23 PART NUMBER: Polymer PTC Devices Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21-50968309 Fax: 86-21-50968310 E-mail: market@way-on.com Surface mount fuses LP-MSM125/16 Http://www.way-on.com Features Small size of 1812 Lead-free and compliant with the European Union RoHS Directive (EU)2015/863 Fast tripping resettable circuit protection Surface mount packaging for automated assembly Agency Recognition: UL、TUV Product Dimensions (mm) LP-MSM125/16 Part marking A B C D E Typ. Typ. Typ. Typ. Typ. 4.50±0.23 3.21±0.20 1.00±0.30 0.50±0.20 0.40±0.20 Part number W125 Electrical Characteristics IH IT Vmax Imax (A) (A) (V) (A) Current(A) 1.25 2.50 16 40 8.0 Part number LP-MSM125/16 Ttrip Pd typ Rmin R1max Time(S) (W) (Ω) (Ω) 0.40 1.0 0.07 0.25 IH=Hold current: maximum current at which the device will not trip at 25℃ still air. IT=Trip current: minimum current at which the device will always trip at 25℃ still air. Vmax=Maximum voltage device can withstand without damage at rated current. Imax=Maximum fault current device can withstand without damage at rated voltage. Ttrip=Maximum time to trip(s) at assigned current. Pdtyp=Typical power dissipation: typical amount of power dissipated by the device when in state air environment. Rmin=Minimum device resistance at 25℃ prior to tripping. R1max=Maximum device resistance measured in the nontripped state 1 hour post reflow. Thermal Derating Maximum ambient operating temperature(℃) LP-MSM125/16 -40 -20 0 20 25 40 50 60 70 85 Hold Current (A) 1.89 1.64 1.41 1.28 1.25 1.09 0.98 0.86 0.74 0.56 Trip Current (A) 3.78 3.28 2.82 2.56 2.50 2.18 1.96 1.72 1.48 1.12 Solder Reflow Recommendations C Solder Pad Layouts Part number LP-MSM125/16 B A B A B C (mm) (mm) (mm) 3.45 1.78 3.15 * Recommended reflow methods: IR, Vapor phase, and hot air oven. * Devices can be cleaned using standard industry methods and solvents. Notes:  If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.  Devices are not designed to be wave soldered to the bottom side of the board. Package Information Tape & Reel: 2000pcs per reel. Effectivity: Reference documents shall be the issue in effect on the date of invitation for bid. Caution: Operation beyond the rated voltage or current may result in rupture electrical arcing or flame. Specifications are subject to change without notice. Page 1 of 2 PDF
Документация на LP-MSM125/16 

Shang Hai Changyuan Wayon

Дата модификации: 27.09.2022

Размер: 213.7 Кб

2 стр.

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