LP-NSM005

DOCUMENT: M20054 REV LETTER: J PAGE NO.: 1 OF 2 REV DATE: 2019-10-24 PART NUMBER: Polymer PTC Devices Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21- 50310888 E-mail: market@way-on.com Surface mount fuses LP-NSM005 Fax: 86-21-50757680 Http://www.way-on.com Features Small size of 1206 Lead-free and compliant with the European Union RoHS Dir...
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Технические характеристики

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Ток удержания
Ток срабатывания
Рабочий ток (max)
Рабочее напряжение (max)
Рабочее сопротивление
Время срабатывания
Корпус
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Аналоги 1

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Тип Наименование Корпус Упаковка i I удерж. I сраб. I макс U макс R Время Особенности Корпус Примечания T раб Карточка
товара
P= FSMD005-1206-R (FUZETEC)
 
SMD120632X16MM в ленте 3000 шт

Файлы 1

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DOCUMENT: M20054 REV LETTER: J PAGE NO.: 1 OF 2 REV DATE: 2019-10-24 PART NUMBER: Polymer PTC Devices Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21- 50310888 E-mail: market@way-on.com Surface mount fuses LP-NSM005 Fax: 86-21-50757680 Http://www.way-on.com Features Small size of 1206 Lead-free and compliant with the European Union RoHS Directive 2011/65/EU Fast tripping resettable circuit protection Surface mount packaging for automated assembly Product Dimensions (mm) Part number A B C D E Typ. Typ. Typ. Typ. Typ. LP-NSM005 3.20±0.30 1.60±0.20 0.80±0.20 0. 60±0.35 0.25±0.15 Part marking X Electrical Characteristics Part number LP-NSM005 IH IT Vmax Imax Ttrip (A) (A) (V) (A) Current(A) 0.05 0.15 60 10 1.0 Pd typ Rmin R1max Time(S) (W) (Ω) (Ω) 1.2 0.6 2.00 50.00 IH=Hold current: maximum current at which the device will not trip at 25℃ still air. IT=Trip current: minimum current at which the device will always trip at 25℃ still air. Vmax=Maximum voltage device can withstand without damage at rated current. Imax=Maximum fault current device can withstand without damage at rated voltage. Ttrip=Maximum time to trip(s) at assigned current. Pdtyp=Typical power dissipation: typical amount of power dissipated by the device when in state air environment. Rmin=Minimum device resistance at 25℃ prior to tripping. R1max=Maximum device resistance measured in the nontripped state 1 hour post reflow. Thermal Derating LP-NSM005 Hold Current (A) Maximum ambient operating temperature(℃) -40 -20 0 20 25 40 50 60 70 85 0.09 0.08 0.06 0.05 0.05 0.04 0.036 0.033 0.029 0.020 Solder Reflow Recommendations C Solder Pad Layouts Part number LP-NSM005 B A B A B C (mm) (mm) (mm) 1.80 1.00 1.80 * Recommended reflow methods: IR, Vapor phase, hot air oven. * Devices can be cleaned using standard industry methods and solvents. Notes:  If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.  Devices are not designed to be wave soldered to the bottom side of the board. Package Information Tape & Reel: 4000pcs per reel. Effectivity: Reference documents shall be the issue in effect on the date of invitation for bid. Caution: Operation beyond the rated voltage or current may result in rupture electrical arcing or flame. Specifications are subject to change without notice. Page 1 of 2 PDF
Документация на LP-NSM005 

Shang Hai Wayon Thermo-Electro

Дата модификации: 26.10.2022

Размер: 207.3 Кб

2 стр.

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