LP-NSM050/16

WAYON
DOCUMENT: M20449 REV LETTER: E PAGE NO: 1 OF 2 REV DATE: 2019-10-25 PART NUMBER: LP-NSM050/16 Polymer PTC Devices Surface mount fuses Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21-50968308 Fax: 86-21-50968310 E-mail: market@way-on.com Http://www.way-on.com Features  Small size of 1206, Normal working temperature with -40℃~85℃  Lead-fre...
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Внешний вид серии LP-NSM(L)

Технические характеристики

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Ток удержания
Ток срабатывания
Рабочий ток (max)
Рабочее напряжение (max)
Рабочее сопротивление
Время срабатывания
Корпус
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Аналоги 1

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Тип Наименование Корпус Упаковка i I удерж. I сраб. I макс U макс R Время Особенности Корпус Примечания T раб Карточка
товара
P= FSMD050-24-1206R (FUZETEC)
 
SMD120632X16MM в ленте 3000 шт
 
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Файлы 1

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DOCUMENT: M20449 REV LETTER: E PAGE NO: 1 OF 2 REV DATE: 2019-10-25 PART NUMBER: LP-NSM050/16 Polymer PTC Devices Surface mount fuses Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21-50968308 Fax: 86-21-50968310 E-mail: market@way-on.com Http://www.way-on.com Features  Small size of 1206, Normal working temperature with -40℃~85℃  Lead-free and compliant with the European Union RoHS Directive 2011/65/EU  Fast tripping resettable circuit protection  Surface mount packaging for automated assembly  Agency Recognition: UL、CSA Product Dimensions (mm) A Max. 3.50 Part number LP-NSM050/16 B Max. 1.80 C Max. 0.85 D Min. 0.25 E Min. 0.10 Part marking A Electrical Characteristics IH (A) 0.50 Part number LP-NSM050/16 IT (A) 1.00 Vmax (V) 16 Imax (A) 40 Ttrip Current(A) Time(S) 8.0 0.10 Pd typ (W) 0.6 Rmin (Ω) 0.15 R1max (Ω) 0.70 IH=Hold current: maximum current at which the device will not trip at 25℃ still air. IT=Trip current: minimum current at which the device will always trip at 25℃ still air. Vmax=Maximum voltage device can withstand without damage at rated current. Imax=Maximum fault current device can withstand without damage at rated voltage. Ttrip=Maximum time to trip(s) at assigned current. Pdtyp=Typical power dissipation: typical amount of power dissipated by the device when in state air environment. Rmin=Minimum device resistance at 25℃ prior to tripping. R1max=Maximum device resistance measured in the nontripped state 1 hour post reflow. Thermal Derating Maximum ambient operating temperature(℃) LP-NSM050/16 -40 0.77 1.54 Hold Current (A) Trip Current (A) -20 0.64 1.28 0 0.56 1.12 20 0.52 1.04 25 0.50 1.00 40 0.45 0.90 50 0.40 0.80 60 0.35 0.70 70 0.32 0.64 85 0.23 0.46 Solder Reflow Recommendations C Solder Pad Layouts B A B A B C (mm) (mm) (mm) LP-NSM050/16 1.80 1.00 1.80 * Recommended reflow methods: IR, Vapor phase, hot air oven. * Devices can be cleaned using standard industry methods and solvents. Notes:  If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.  Devices are not designed to be wave soldered to the bottom side of the board. Part number Package Information Tape & Reel: 4000pcs per reel. Effectivity: Reference documents shall be the issue in effect on the date of invitation for bid. Caution: Operation beyond the rated voltage or current may result in rupture electrical arcing or flame. Specifications are subject to change without notice page 1 of 2 PDF
Документация на LP-NSM050/16 

Shang Hai Wayon Thermo-Electro

Дата модификации: 01.01.2023

Размер: 239.4 Кб

2 стр.

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