LP-NSM075/8

DOCUMENT: M20221 REV LETTER: C PAGE NO: 1 OF 2 DATE: 2020-06-10 PART NUMBER: Polymer PTC Devices Surface mount fuses Wayon Electronics Co., Ltd. 1001 Shiwan 7th Road, Shanghai, 201207 P.R. China Tel: 86-21-50968308 Fax: 86-21-50968310 E-mail: market@way-on.com Http://www.way-on.com LP-NSM075/8 Features  Small size of 1206  Lead-free and compliant with the European Union RoHS Directive...
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DOCUMENT: M20221 REV LETTER: C PAGE NO: 1 OF 2 DATE: 2020-06-10 PART NUMBER: Polymer PTC Devices Surface mount fuses Wayon Electronics Co., Ltd. 1001 Shiwan 7th Road, Shanghai, 201207 P.R. China Tel: 86-21-50968308 Fax: 86-21-50968310 E-mail: market@way-on.com Http://www.way-on.com LP-NSM075/8 Features  Small size of 1206  Lead-free and compliant with the European Union RoHS Directive 2011/65/EU  Fast tripping resettable circuit protection  Surface mount packaging for automated assembly  Agency Recognition: UL、TUV Product Dimensions (mm) Part number LP-NSM075/8 A B C D E Max. Max. Max. Min. Min. 3.50 1.80 1.00 0.25 0.10 Part marking Y Electrical Characteristics Part number LP-NSM075/8 IH IT Vmax Imax Ttrip (A) (A) (V) (A) Current(A) 0.75 1.50 8 40 8.0 Pd typ Rmin R1max Time(S) (W) (Ω) (Ω) 0.20 1.2 0.10 0.29 IH=Hold current: maximum current at which the device will not trip at 25℃ still air. IT=Trip current: minimum current at which the device will always trip at 25℃ still air. Vmax=Maximum voltage device can withstand without damage at rated current. Imax=Maximum fault current device can withstand without damage at rated voltage. Ttrip=Maximum time to trip(s) at assigned current. Pdtyp=Typical power dissipation: typical amount of power dissipated by the device when in state air environment. Rmin=Minimum device resistance at 25℃ prior to tripping. R1max=Maximum device resistance measured in the nontripped state 1 hour post reflow. Solder Reflow Recommendations C Solder Pad Layouts Part number LP-NSM075/8 B A B A B C (mm) (mm) (mm) 1.80 1.00 1.80 * Recommended reflow methods: IR, Vapor phase, hot air oven. * Devices can be cleaned using standard industry methods and solvents. Notes:  If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.  Devices are not designed to be wave soldered to the bottom side of the board. Package Information Tape & Reel: 4000pcs per reel. Effectivity: Reference documents shall be the issue in effect on the date of invitation for bid. Caution: Operation beyond the rated voltage or current may result in rupture electrical arcing or flame. Specifications are subject to change without notice. Specifications are subject to change without notice. Page 1 of 2 PDF
Документация на LP-NSM075/8 

Shang Hai Wayon Thermo-Electro

Дата модификации: 14.06.2022

Размер: 235.5 Кб

2 стр.

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