LP-NSM110

WAYON
DOCUMENT：M20096 REV LETTER：I PAGE NO：1 OF 2 REV DATE：2020-06-19 PART NUMBER： Polymer PTC Devices Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21-50968308 Fax: 86-21-50968310 Surface mount fuses E-mail: market@way-on.com LP-NSM110 Http://www.way-on.com Features Small size of 1206 Lead-free and compliant with the European Union RoHS Direc...
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Внешний вид серии LP-NSM(L)

Технические характеристики

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Ток удержания
Ток срабатывания
Рабочий ток (max)
Рабочее напряжение (max)
Рабочее сопротивление
Время срабатывания
Корпус
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Аналоги 1

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Тип Наименование Корпус Упаковка i I удерж. I сраб. I макс U макс R Время Особенности Корпус Примечания T раб Карточка
товара
P= FSMD110-1206R (FUZETEC)
 
SMD120632X16MM 490 шт
 
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Файлы 1

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DOCUMENT：M20096 REV LETTER：I PAGE NO：1 OF 2 REV DATE：2020-06-19 PART NUMBER： Polymer PTC Devices Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21-50968308 Fax: 86-21-50968310 Surface mount fuses E-mail: market@way-on.com LP-NSM110 Http://www.way-on.com Features Small size of 1206 Lead-free and compliant with the European Union RoHS Directive 2011/65/EU Fast tripping resettable circuit protection Surface mount packaging for automated assembly Agency Recognition: UL、TUV Product Dimensions (mm) Part number LP-NSM110 A B C D E Typ. Typ. Typ. Typ. Typ. 3.20±0.30 1.60±0.20 1.00±0.30 0.50±0.25 0.30±0.20 Part marking O Electrical Characteristics Part number LP-NSM110 IH IT Vmax Imax Ttrip (A) (A) (V) (A) Current(A) 1.10 2.20 6 40 8.0 Pd typ Rmin R1max Time(S) (W) (Ω) (Ω) 0.30 0.6 0.055 0.210 IH=Hold current: maximum current at which the device will not trip at 25℃ still air. IT=Trip current: minimum current at which the device will always trip at 25℃ still air. Vmax=Maximum voltage device can withstand without damage at rated current. Imax=Maximum fault current device can withstand without damage at rated voltage. Ttrip=Maximum time to trip(s) at assigned current. Pdtyp=Typical power dissipation: typical amount of power dissipated by the device when in state air environment. Rmin=Minimum device resistance at 25℃ prior to tripping. R1max=Maximum device resistance measured in the nontripped state 1 hour post reflow. Thermal Derating Maximum ambient operating temperature(℃) LP-NSM110 -40 -20 0 20 25 40 50 60 70 85 Hold Current (A) 1.61 1.44 1.27 1.12 1.10 0.94 0.85 0.77 0.63 0.48 Trip Current (A) 3.22 2.88 2.54 2.24 2.20 1.88 1.70 1.54 1.26 0.96 Solder Reflow Recommendations C Solder Pad Layouts Part number LP-NSM110 B A B A B C (mm) (mm) (mm) 1.80 1.00 1.80 * Recommended reflow methods: IR, Vapor phase, hot air oven. * Devices can be cleaned using standard industry methods and solvents. Notes:  If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.  Devices are not designed to be wave soldered to the bottom side of the board. Package Information Tape & Reel: 3500pcs per reel. Effectivity: Reference documents shall be the issue in effect on the date of invitation for bid. Caution: Operation beyond the rated voltage or current may result in rupture electrical arcing or flame. Specifications are subject to change without notice. Page 1 of 2 PDF
Документация на LP-NSM110 

Shang Hai Wayon Thermo-Electro

Дата модификации: 08.07.2022

Размер: 227.8 Кб

2 стр.

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