LP-NSM150

WAYON
DOCUMENT: M20026 REV LETTER: L PAGE NO: 1 OF 2 REV DATE: 2019-10-16 PART NUMBER: Polymer PTC Devices Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21-50968308 Fax: 86-21-50968310 Surface mount fuses E-mail: market@way-on.com LP-NSM150 Http://www.way-on.com Features Small size of 1206 Lead-free and compliant with the European Union RoHS Direct...
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Внешний вид серии LP-NSM(L)

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Ток удержания
Ток срабатывания
Рабочий ток (max)
Рабочее напряжение (max)
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DOCUMENT: M20026 REV LETTER: L PAGE NO: 1 OF 2 REV DATE: 2019-10-16 PART NUMBER: Polymer PTC Devices Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21-50968308 Fax: 86-21-50968310 Surface mount fuses E-mail: market@way-on.com LP-NSM150 Http://www.way-on.com Features Small size of 1206 Lead-free and compliant with the European Union RoHS Directive 2011/65/EU Fast tripping resettable circuit protection Surface mount packaging for automated assembly Product Dimensions (mm) LP-NSM150 Part marking A B C D E Typ. Typ. Typ. Typ. Typ. 3.20±0.20 1.60±0.20 0.70±0.20 0. 50±0.10 0.20±0.10 Part number N Electrical Characteristics IH IT Vmax Imax (A) (A) (V) (A) Current(A) 1.50 3.00 6 40 8.0 Part number LP-NSM150 Ttrip Pd typ Rmin R1max Time(S) (W) (Ω) (Ω) 1.00 0.6 0.040 0.120 IH=Hold current: maximum current at which the device will not trip at 25℃ still air. IT=Trip current: minimum current at which the device will always trip at 25℃ still air. Vmax=Maximum voltage device can withstand without damage at rated current. Imax=Maximum fault current device can withstand without damage at rated voltage. Ttrip=Maximum time to trip(s) at assigned current. Pdtyp=Typical power dissipation: typical amount of power dissipated by the device when in state air environment. Rmin=Minimum device resistance at 25℃ prior to tripping. R1max=Maximum device resistance measured in the nontripped state 1 hour post reflow. Thermal Derating Maximum ambient operating temperature(℃) LP-NSM150 -40 -20 0 20 25 40 50 60 70 85 Hold Current (A) 2.03 1.80 1.63 1.55 1.50 Trip Current (A) 4.06 3.60 3.26 3.10 3.0 1.24 1.11 1.03 0.88 0.69 2.48 2.22 2.06 1.76 1.3 Solder Reflow Recommendations C Solder Pad Layouts B A B A B C (mm) (mm) (mm) LP-NSM150 1.80 1.00 1.80 * Recommended reflow methods: IR, Vapor phase, hot air oven. * Devices can be cleaned using standard industry methods and solvents. Notes:  If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.  Devices are not designed to be wave soldered to the bottom side of the board. Part number Package Information Tape & Reel: 4000pcs per reel. Effectivity: Reference documents shall be the issue in effect on the date of invitation for bid. Caution: Operation beyond the rated voltage or current may result in rupture electrical arcing or flame. Specifications are subject to change without notice. Page 1 of 2 PDF
Документация на LP-NSM150 

Shang Hai Wayon Thermo-Electro

Дата модификации: 19.10.2022

Размер: 215.7 Кб

2 стр.

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