LP-NSM150/8

WAYON
DOCUMENT: M20797 REV LETTER: C PAGE NO: 1 OF 2 REV DATE: 2019-09-30 PART NUMBER: LP-NSM150/8 Polymer PTC Devices Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21-50968308 Fax: 86-21-50968310 Http://www.way-on.com E-mail: market@way-on.com Surface mount fuses Features Small size of 1206, Normal working temperature with -40℃~85℃ Lead-free and ...
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Внешний вид серии LP-NSM(L)

Технические характеристики

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Ток удержания
Ток срабатывания
Рабочий ток (max)
Рабочее напряжение (max)
Рабочее сопротивление
Время срабатывания
Корпус
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Аналоги 1

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Тип Наименование Корпус Упаковка i I удерж. I сраб. I макс U макс R Время Особенности Корпус Примечания T раб Карточка
товара
P= FSMD150-1206R (FUZETEC)
 
SMD120632X16MM 150 шт
 
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Файлы 1

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DOCUMENT: M20797 REV LETTER: C PAGE NO: 1 OF 2 REV DATE: 2019-09-30 PART NUMBER: LP-NSM150/8 Polymer PTC Devices Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21-50968308 Fax: 86-21-50968310 Http://www.way-on.com E-mail: market@way-on.com Surface mount fuses Features Small size of 1206, Normal working temperature with -40℃~85℃ Lead-free and compliant with the European Union RoHS Directive 2011/65/EU Fast tripping resettable circuit protection Surface mount packaging for automated assembly Product Dimensions (mm) Part number LP-NSM150/8 A B C D E Max. Max. Max. Min. Min. 3.50 1.80 1.30 0.25 0.10 Part marking N Electrical Characteristics Part number LP-NSM150/8 IH IT Vmax Imax Ttrip (A) (A) (V) (A) Current(A) 1.50 3.00 8 40 8.0 Pd typ Rmin R1max Time(S) (W) (Ω) (Ω) 1.00 1.2 0.040 0.120 IH=Hold current: maximum current at which the device will not trip at 25℃ still air. IT=Trip current: minimum current at which the device will always trip at 25℃ still air. Vmax=Maximum voltage device can withstand without damage at rated current. Imax=Maximum fault current device can withstand without damage at rated voltage. Ttrip=Maximum time to trip(s) at assigned current. Pdtyp=Typical power dissipation: typical amount of power dissipated by the device when in state air environment. Rmin=Minimum device resistance at 25℃ prior to tripping. R1max=Maximum device resistance measured in the nontripped state 1 hour post reflow. Thermal Derating Maximum ambient operating temperature(℃) LP-NSM150/8 -40 -20 0 20 25 40 50 60 70 85 Hold Current (A) 2.03 1.80 1.63 1.55 1.50 1.24 1.11 1.03 0.88 0.69 Trip Current (A) 4.06 3.60 3.26 3.10 3.00 2.48 2.22 2.06 1.76 1.38 Solder Reflow Recommendations C Solder Pad Layouts B A B A B C (mm) (mm) (mm) LP-NSM150/8 1.80 1.00 1.80 * Recommended reflow methods: IR, Vapor phase, hot air oven. * Devices can be cleaned using standard industry methods and solvents. Notes:  If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.  Devices are not designed to be wave soldered to the bottom side of the board. Part number Package Information Tape & Reel: 4000pcs per reel. Effectivity: Reference documents shall be the issue in effect on the date of invitation for bid. Caution: Operation beyond the rated voltage or current may result in rupture electrical arcing or flame. Specifications are subject to change without notice. Page 1 of 2 PDF
Документация на LP-NSM150/8 

Shang Hai Wayon Thermo-Electro

Дата модификации: 11.03.2022

Размер: 238 Кб

2 стр.

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