LP-NSML110/8

WAYON
DOCUMENT: M20212 REV LETTER: F PAGE NO: 1 OF 2 REV DATE: 2020-04-22 PART NUMBER: LP-NSML110/8 Polymer PTC Devices Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21-50968308 Fax: 86-21-50968310 Surface mount fuses Http://www.way-on.com E-mail: market@way-on.com Features  Small size of 1206  Low resistance  Lead-free and compliant with ...
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DOCUMENT: M20212 REV LETTER: F PAGE NO: 1 OF 2 REV DATE: 2020-04-22 PART NUMBER: LP-NSML110/8 Polymer PTC Devices Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21-50968308 Fax: 86-21-50968310 Surface mount fuses Http://www.way-on.com E-mail: market@way-on.com Features  Small size of 1206  Low resistance  Lead-free and compliant with the European Union RoHS Directive 2011/65/EU  Fast time-to-trip  Agency Recognition: UL Product Dimensions (mm) Part number LP-NSML110/8 A B C D E Max. Max. Max. Min. Min. 3.43 1.80 0.70 0.25 0.10 Electrical Characteristics IH Part number LP-NSML110/8 IT Vmax Imax Ttrip Pd max Rmin R1max (A) (A) (V) (A) Current(A) Time(S) (W) (Ω) (Ω) 1.10 2.20 8 50 8.0 0.3 0.8 0.015 0.100 IH=Hold current: maximum current at which the device will not trip at 25℃ still air. IT=Trip current: minimum current at which the device will always trip at 25℃ still air. Vmax=Maximum voltage device can withstand without damage at rated current. Imax=Maximum fault current device can withstand without damage at rated voltage. Ttrip=Maximum time to trip(s) at assigned current. Pdmax=Maximum power dissipation: typical amount of power dissipated by the device when in state air environment. Rmin=Minimum device resistance at 25℃ prior to tripping. R1max=Maximum device resistance measured in the nontripped state 1 hour post reflow. Thermal Derating Maximum ambient operating temperature(℃) LP-NSML110/8 Hold Current (A) -40 1.61 -20 1.44 0 1.27 20 1.12 25 1.10 40 0.94 50 0.85 60 0.77 70 0.63 85 0.48 Solder Reflow Recommendations C Solder Pad Layouts Part number LP-NSML110/8 B A B A (mm) 1.80 B C (mm) (mm) 1.00 1.80 * Recommended reflow methods: IR, Vapor phase, hot air oven. * Devices can be cleaned using standard industry methods and solvents. Notes:  If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.  Devices are not designed to be wave soldered to the bottom side of the board. Package Information Tape & Reel: 4000pcs per reel. Effectivity: Reference documents shall be the issue in effect on the date of invitation for bid. Caution: Operation beyond the rated voltage or current may result in rupture electrical arcing or flame. Specifications are subject to change without notice. Page 1 of 2 PDF
Документация на LP-NSML110/8 

Shang Hai Wayon Thermo-Electro

Дата модификации: 27.04.2022

Размер: 257.6 Кб

2 стр.

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