LP-NSML200/12

WAYON
DOCUMENT: M20509 REV LETTER: G PAGE NO: 1 OF 2 REV DATE: 2019-10-18 PART NUMBER: LP-NSML200/12 Polymer PTC Devices Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21-50968308 Fax: 86-21-50968310 Http://www.way-on.com Surface mount fuses E-mail: market@way-on.com Features Small size of 1206 Low resistance Lead-free and compliant with the Europea...
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DOCUMENT: M20509 REV LETTER: G PAGE NO: 1 OF 2 REV DATE: 2019-10-18 PART NUMBER: LP-NSML200/12 Polymer PTC Devices Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21-50968308 Fax: 86-21-50968310 Http://www.way-on.com Surface mount fuses E-mail: market@way-on.com Features Small size of 1206 Low resistance Lead-free and compliant with the European Union RoHS Directive 2011/65/EU Fast time-to-trip Agency Recognition: UL、CSA Product Dimensions (mm) Part number LP-NSML200/12 A B C D E Max. Max. Max. Min. Min. Part marking 3.43 1.80 1.00 0.25 0.10 F2 Electrical Characteristics Part number LP-NSML200/12 IH IT Vmax Imax Ttrip (A) (A) (V) (A) Current(A) 2.0 6.0 12 50 10.0 Pd typ Rmin R1max Time(S) (W) (Ω) (Ω) 5.0 0.8 0.003 0.025 IH=Hold current: maximum current at which the device will not trip at 25℃ still air. IT=Trip current: minimum current at which the device will always trip at 25℃ still air. Vmax=Maximum voltage device can withstand without damage at rated current. Imax=Maximum fault current device can withstand without damage at rated voltage. Ttrip=Maximum time to trip(s) at assigned current. Pdtyp=Typical power dissipation: typical amount of power dissipated by the device when in state air environment. Rmin=Minimum device resistance at 25℃ prior to tripping. R1max=Maximum device resistance measured in the nontripped state 1 hour post reflow. Thermal Derating Maximum ambient operating temperature(℃) LP-NSML200/12 -40 -20 0 20 25 40 50 60 70 85 Hold Current (A) 2.68 2.33 2.15 2.03 2.00 1.66 1.49 1.37 1.14 0.80 Trip Current (A) 8.04 6.99 6.45 6.09 6.00 4.98 4.47 4.11 3.42 2.40 Solder Reflow Recommendations C Solder Pad Layouts Part number LP-NSML200/12 B A B A B C (mm) (mm) (mm) 1.80 1.00 1.80 * Recommended reflow methods: IR, Vapor phase, hot air oven. * Devices can be cleaned using standard industry methods and solvents. Notes:  If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.  Devices are not designed to be wave soldered to the bottom side of the board. Package Information Tape & Reel: 4000pcs per reel. Effectivity: Reference documents shall be the issue in effect on the date of invitation for bid. Caution: Operation beyond the rated voltage or current may result in rupture electrical arcing or flame. Specifications are subject to change without notice. Page 1 of 2 PDF
Документация на LP-NSML200/12 

Shang Hai Wayon Thermo-Electro

Дата модификации: 20.10.2022

Размер: 239.7 Кб

2 стр.

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