LP-NSML400

WAYON
DOCUMENT: M20124 REV LETTER: M PAGE NO: 1 OF 2 REV DATE: 2020-05-09 PART NUMBER: Polymer PTC Devices Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21-50968309 Fax: 86-21-50968310 Http://www.way-on.com Surface mount fuses E-mail: market@way-on.com LP-NSML400 Features  Small size of 1206  Low resistance  Lead-free and compliant with the ...
развернуть ▼ свернуть ▲
Внешний вид серии LP-NSM(L)

Технические характеристики

показать свернуть
Ток удержания
Ток срабатывания
Рабочий ток (max)
Рабочее напряжение (max)
Рабочее сопротивление
Время срабатывания
Корпус
Нашли ошибку? Выделите её курсором и нажмите CTRL + ENTER

Файлы 1

показать свернуть
DOCUMENT: M20124 REV LETTER: M PAGE NO: 1 OF 2 REV DATE: 2020-05-09 PART NUMBER: Polymer PTC Devices Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21-50968309 Fax: 86-21-50968310 Http://www.way-on.com Surface mount fuses E-mail: market@way-on.com LP-NSML400 Features  Small size of 1206  Low resistance  Lead-free and compliant with the European Union RoHS Directive 2011/65/EU  Fast time-to-trip  Halogen-free  Agency Recognition: UL、TUV Product Dimensions (mm) Part number A B C D E Max. Max. Max. Min. Min. Part marking 3.50 1.80 1.00 0.25 0.10 L4 LP-NSML400 Electrical Characteristics Maximum Electrical Rating  Operating Voltage: 6 Vdc  Interrupt Current: 50 A PART NUMBER LP-NSML400 HOLD CURRENT & TRIP CURRENT(AMPS) 25℃ TIME-TO-TRIP (SECONDS) REFERENCE RESISTANCE (OHMS) ONE HOUR POST TRIP RESISTANCE (OHMS) TRIPPED STATE POWER DISSIPATION (WATTS) 8 A @ 25℃ 25℃ 25℃ 25℃,6V Hold Trip Min. Max. Min Max. * Max. Max 4.0 8.0 - 60 0.002 0.014 0.020 1.5 *: Maximum resistance is measured 1 hour after reflow. Thermal Derating Maximum ambient operating temperature(℃) LP-NSML400 Hold Current (A) Trip Current (A) -40 5.80 11.60 -20 5.63 11.25 0 4.85 9.70 20 4.20 8.40 25 4.00 8.00 40 3.66 7.32 50 3.12 6.24 60 2.88 5.76 70 2.40 4.80 85 1.75 3.50 Solder Reflow Recommendations C Solder Pad Layouts B A B Specifications are subject to change without notice. A B C (mm) (mm) (mm) LP-NSML400 1.80 1.00 1.80 * Recommended reflow methods: IR, Vapor phase, hot air oven. * Devices can be cleaned using standard industry methods and solvents. Notes:  If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.  Devices are not designed to be wave soldered to the bottom side of the board. Package Information Tape & Reel: 4000pcs per reel. Effectivity: Reference documents shall be the issue in effect on the date of invitation for bid. Caution: Operation beyond the rated voltage or current may result in rupture electrical arcing or flame. Part number Page 1 of 2 PDF
Документация на LP-NSML400 

Shang Hai Wayon Thermo-Electro

Дата модификации: 11.08.2022

Размер: 245 Кб

2 стр.

    Внимание! Точность указанного на сайте описания товара не может быть гарантирована. Для получения более полной и точной информации о товаре смотрите техническое описание (Datasheet) на сайте производителя.

    MF-MSMF014-2 (BOURNS)