LP-NSML700

WAYON
DOCUMENT: M20749 REV LETTER: C PAGE NO: 1 OF 2 REV DATE: 2019-09-10 PART NUMBER: LP-NSML700 Polymer PTC Devices Surface mount fuses Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21-50968309 Fax: 86-21-50968310 Http://www.way-on.com E-mail: market@way-on.com Features Small size of 1206 Low resistance Halogen-free and compliant with the Europea...
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DOCUMENT: M20749 REV LETTER: C PAGE NO: 1 OF 2 REV DATE: 2019-09-10 PART NUMBER: LP-NSML700 Polymer PTC Devices Surface mount fuses Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21-50968309 Fax: 86-21-50968310 Http://www.way-on.com E-mail: market@way-on.com Features Small size of 1206 Low resistance Halogen-free and compliant with the European Union RoHS Directive 2011/65/EU Fast time-to-trip Agency Recognition: UL、TUV Product Dimensions (mm) Part number LP-NSML700 A B C D E Max. Max. Max. Min. Min. 3.50 1.90 1.30 0.25 0.05 Part marking L70 Electrical Characteristics Part number LP-NSML700 IH IT Vmax Imax Pd typ Rmin R1max (A) (A) (V) (A) Current(A) Ttrip Time(S) (W) (Ω) (Ω) 7.0 14.0 6.0 50.0 35.0 2.0 1.2 0.001 0.007 IH=Hold current: maximum current at which the device will not trip at 25℃ still air. IT=Trip current: minimum current at which the device will always trip at 25℃ still air. Vmax=Maximum voltage device can withstand without damage at rated current. Imax=Maximum fault current device can withstand without damage at rated voltage. Ttrip=Maximum time to trip(s) at assigned current. Pdtyp=Typical power dissipation: typical amount of power dissipated by the device when in state air environment. Rmin= Minimum device resistance at 25℃ prior to tripping. R1max= Maximum device resistance at 25℃ prior to tripping Thermal Derating Maximum ambient operating temperature(℃) LP-NSML700 -40 -20 0 20 25 40 50 60 70 85 Hold Current (A) 10.10 9.28 8.45 7.17 7.00 5.95 5.29 4.73 4.26 3.30 10.58 9.46 8.52 6.60 Trip Current (A) 20.20 18.56 16.90 14.34 14.00 11.90 Note:PTC can hold 1 hour in above current at a given temperature. *Value specified were determined using the PWB with 4.0mm*1.5oz copper traces. Solder Reflow Recommendations C Solder Pad Layouts B A B A B C (mm) (mm) (mm) LP-NSML700 1.80 1.00 1.80 * Recommended reflow methods: IR, Vapor phase, hot air oven. * Devices can be cleaned using standard industry methods and solvents. Notes:  If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.  Devices are not designed to be wave soldered to the bottom side of the board. Part number Package Information Tape & Reel: 3500pcs per reel. Effectivity: Reference documents shall be the issue in effect on the date of invitation for bid. Caution: Operation beyond the rated voltage or current may result in rupture electrical arcing or flame. Specifications are subject to change without notice. Page 1 of 2 PDF
Документация на LP-NSML700 

Shang Hai Wayon Thermo-Electro

Дата модификации: 17.03.2022

Размер: 237.9 Кб

2 стр.

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