LP-SM125

DOCUMENT: M20325 REV LETTER: E PAGE NO: 1 OF 2 DATE: 2020-07-28 PART NUMBER: LP-SM125 Polymer PTC Devices Surface mount fuses Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21-50968309 Fax: 86-21-50968310 E-mail: market@way-on.com Http://www.way-on.com Features Fast tripping resettable circuit protection Lead-free, halogen-free and compliant w...
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Ток срабатывания
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Рабочее напряжение (max)
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DOCUMENT: M20325 REV LETTER: E PAGE NO: 1 OF 2 DATE: 2020-07-28 PART NUMBER: LP-SM125 Polymer PTC Devices Surface mount fuses Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21-50968309 Fax: 86-21-50968310 E-mail: market@way-on.com Http://www.way-on.com Features Fast tripping resettable circuit protection Lead-free, halogen-free and compliant with the European Union RoHS Directive 2011/65/EU Surface mount packaging for automated assembly Agency Recognition: UL、TUV Product Dimensions (mm) Part number A Max B Max C Max D Min LP-SM125 7.98 3.18 5.44 0.50 Ttrip Pd typ Rmin R1max Part Marking 125 Electrical Characteristics Part number LP-SM125 IH IT Vmax Imax (A) (A) (V) (A) Current(A) Time(S) (W) (Ω) (Ω) 1.25 2.50 15 40 8.0 2.00 1.6 0.070 0.250 IH=Hold current: maximum current at which the device will not trip at 25℃ still air. IT=Trip current: minimum current at which the device will always trip at 25℃ still air. Vmax=Maximum voltage device can withstand without damage at rated current. Imax=Maximum fault current device can withstand without damage at rated voltage. Ttrip=Maximum time to trip(s) at assigned current. Pdtyp=Typical power dissipation: typical amount of power dissipated by the device when in state air environment. Rmin=Minimum device resistance at 25℃ prior to tripping. R1max=Maximum device resistance measured in the nontripped state 1 hour post reflow. Thermal Derating Maximum ambient operating temperature(℃) LP-SM125 -40 -20 0 20 25 40 50 60 70 85 Hold Current (A) 1.99 1.75 1.51 1.30 1.25 1.07 0.94 0.83 0.69 0.46 Trip Current (A) 3.98 3.50 3.02 2.60 2.50 2.14 1.88 1.66 1.38 0.92 Solder Reflow Recommendations C Solder Pad Layouts Part number LP-SM125 B A B A B C (mm) (mm) (mm) 5.10 2.30 3.10 * Recommended reflow methods: IR, Vapor phase oven, hot air oven solder. * Devices can be cleaned using standard industry methods and solvents. Notes: If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. Package Information Tape & Reel: 2000pcs per reel. Specifications are subject to change without notice. Page 1 of 2 PDF
Документация на LP-SM125 

Shang Hai Wayon Thermo-Electro

Дата модификации: 01.08.2022

Размер: 256.6 Кб

2 стр.

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