LP-SM150

WAYON
DOCUMENT: M20298 REV LETTER: F PAGE NO: 1 OF 2 REV DATE: 2020-01-07 PART NUMBER: Polymer PTC Devices Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21-50968309 Fax: 86-21-50968310 Http://www.way-on.com Surface mount fuses E-mail: market@way-on.com LP-SM150 Features Fast tripping resettable circuit protection Lead-free and compliant with the Eur...
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DOCUMENT: M20298 REV LETTER: F PAGE NO: 1 OF 2 REV DATE: 2020-01-07 PART NUMBER: Polymer PTC Devices Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21-50968309 Fax: 86-21-50968310 Http://www.way-on.com Surface mount fuses E-mail: market@way-on.com LP-SM150 Features Fast tripping resettable circuit protection Lead-free and compliant with the European Union RoHS Directive 2011/65/EU Surface mount packaging for automated assembly Agency Recognition: UL、TUV Product Dimensions (mm) Part number LP-SM150 A B C D Max Max Max Min 9.50 3.00 6.71 0.50 Part marking 150 Electrical Characteristics Part number LP-SM150 IH IT Vmax Imax Pd typ Rmin R1max (A) (A) (V) (A) Current(A) Ttrip Time(S) (W) (Ω) (Ω) 1.50 3.00 33 40 8.0 5.00 2.1 0.060 0.250 IH=Hold current: maximum current at which the device will not trip at 25℃ still air. IT=Trip current: minimum current at which the device will always trip at 25℃ still air. Vmax=Maximum voltage device can withstand without damage at rated current. Imax=Maximum fault current device can withstand without damage at rated voltage. Ttrip=Maximum time to trip(s) at assigned current. Pdtyp=Typical power dissipation: typical amount of power dissipated by the device when in state air environment. Rmin=Minimum device resistance at 25℃ prior to tripping. R1max=Maximum device resistance measured in the nontripped state 1 hour post reflow. Thermal Derating Maximum ambient operating temperature(℃) LP-SM150 -40 2.42 4.84 Hold Current (A) Trip Current (A) -20 2.10 4.20 0 1.81 3.62 20 1.52 3.04 25 1.50 3.00 40 1.30 2.60 50 1.11 2.22 60 1.01 2.02 70 0.85 1.70 85 0.57 1.14 Solder Reflow Recommendations C Solder Pad Layout B A B A B C (mm) (mm) (mm) LP-SM150 6.10 2.30 4.60 * Recommended reflow methods: IR, Vapor phase oven, hot air oven solder. * Devices can be cleaned using standard industry methods and solvents. Notes: If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. Part number Package Information Tape & Reel: 1500pcs per reel. Effectivity: Reference documents shall be the issue in effect on the date of invitation for bid. Caution: Operation beyond the rated voltage or current may result in rupture electrical arcing or flame. Specifications are subject to change without notice. Page 1 of 2 PDF
Документация на LP-SM150 

Shang Hai Wayon Thermo-Electro

Дата модификации: 10.01.2022

Размер: 275.4 Кб

2 стр.

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