LP-SM185C/33

DOCUMENT: M20233 REV LETTER: G PAGE NO: 1 OF 2 REV DATE:2019-09-06 PART NUMBER: LP-SM185C/33 Polymer PTC Devices Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21-50968309 Fax: 86-21-50968310 Surface mount fuses E-mail: market@way-on.com Http://www.way-on.com Features  Fast tripping resettable circuit protection  Lead-free and compliant w...
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Ток удержания
Ток срабатывания
Рабочий ток (max)
Рабочее напряжение (max)
Рабочее сопротивление
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DOCUMENT: M20233 REV LETTER: G PAGE NO: 1 OF 2 REV DATE:2019-09-06 PART NUMBER: LP-SM185C/33 Polymer PTC Devices Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21-50968309 Fax: 86-21-50968310 Surface mount fuses E-mail: market@way-on.com Http://www.way-on.com Features  Fast tripping resettable circuit protection  Lead-free and compliant with the European Union RoHS Directive 2011/65/EU  Surface mount packaging for automated assembly Product Dimensions (mm) Part number LP-SM185C/33 A B C D E Max Max Max Min Min 7.98 5.44 1.25 0.80 0.30 Electrical Characteristics Part number LP-SM185C/33 IH IT Vmax Imax Pd typ Rmin R1max (A) (A) (V) (A) Current(A) Ttrip Time(S) (W) (Ω) (Ω) 1.85 3.70 33 40 8.0 5.00 2.1 0.045 0.165 IH=Hold current: maximum current at which the device will not trip at 25℃ still air. IT=Trip current: minimum current at which the device will always trip at 25℃ still air. Vmax=Maximum voltage device can withstand without damage at rated current. Imax=Maximum fault current device can withstand without damage at rated voltage. Ttrip=Maximum time to trip(s) at assigned current. Pdtyp=Typical power dissipation: typical amount of power dissipated by the device when in state air environment. Rmin=Minimum device resistance at 25℃ prior to tripping. R1max=Maximum device resistance measured in the nontripped state 1 hour post reflow. Thermal Derating LP-SM185C/33 Hold Current (A) Maximum ambient operating temperature(℃) -40 -20 0 20 25 40 50 60 70 85 2.95 2.58 2.28 1.87 1.85 1.64 1.34 1.24 1.03 0.72 Solder Reflow Recommendations Solder Pad Layouts Part number LP-SM185C/33 A B C (mm) (mm) (mm) 4.60 2.00 5.30 * Recommended reflow methods: IR, Vapor phase oven, hot air oven solder. * Devices can be cleaned using standard industry methods and solvents. Notes: If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. Package Information Tape & Reel: 6000pcs per reel. Specifications are subject to change without notice .Page 1 of 2 PDF
Документация на LP-SM185C/33 

Shang Hai Wayon Thermo-Electro

Дата модификации: 31.10.2022

Размер: 215.4 Кб

2 стр.

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