LP-SM200C

DOCUMENT: M20089 REV LETTER: F PAGE NO: 1 OF 2 REV DATE: 2019-11-13 PART NUMBER: LP-SM200C Polymer PTC Devices Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21-50968308 Fax: 86-21-50968310 Surface mount fuses E-mail: market@way-on.com Http://www.way-on.com Features Small size of 2920 Fast tripping resettable circuit protection Lead-free and ...
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Ток удержания
Ток срабатывания
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Рабочее напряжение (max)
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DOCUMENT: M20089 REV LETTER: F PAGE NO: 1 OF 2 REV DATE: 2019-11-13 PART NUMBER: LP-SM200C Polymer PTC Devices Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21-50968308 Fax: 86-21-50968310 Surface mount fuses E-mail: market@way-on.com Http://www.way-on.com Features Small size of 2920 Fast tripping resettable circuit protection Lead-free and compliant with the European Union RoHS Directive 2011/65/EU Surface mount packaging for automated assembly Product Dimensions (mm) Part number LP-SM200C A B C D E Max Max Max Min Min 7.98 5.44 1.50 0.80 0.30 Part marking SM 200 Electrical Characteristics Part number LP-SM200C IH IT Vmax Imax Ttrip (A) (A) (V) (A) Current(A) 2.00 4.00 15 40 8.0 Pd typ Rmin R1max Time(S) (W) (Ω) (Ω) 12.00 2.1 0.045 0.125 IH=Hold current: maximum current at which the device will not trip at 25℃ still air. IT=Trip current: minimum current at which the device will always trip at 25℃ still air. Vmax=Maximum voltage device can withstand without damage at rated current. Imax=Maximum fault current device can withstand without damage at rated voltage. Ttrip=Maximum time to trip(s) at assigned current. Pdtyp=Typical power dissipation: typical amount of power dissipated by the device when in state air environment. Rmin=Minimum device resistance at 25℃ prior to tripping. R1max=Maximum device resistance measured in the nontripped state 1 hour post reflow. Solder Reflow Recommendations C Solder Pad Layouts Part number LP-SM200C B A B A B C (mm) 4.60 (mm) 2.00 (mm) 5.30 * Recommended reflow methods: IR, Vapor phase, hot air oven. * Devices can be cleaned using standard industry methods and solvents. Notes:  If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.  Devices are not designed to be wave soldered to the bottom side of the board. Package Information Tape & Reel: 6000pcs per reel. Effectivity: Reference documents shall be the issue in effect on the date of invitation for bid. Caution: Operation beyond the rated voltage or current may result in rupture electrical arcing or flame. Specifications are subject to change without notice. Page 1 of 2 PDF
Документация на LP-SM200C 

Shang Hai Wayon Thermo-Electro

Дата модификации: 16.11.2022

Размер: 225.8 Кб

2 стр.

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