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LP-SM250

WAYON
DOCUMENT: M20088 REV LETTER: H PAGE NO: 1 OF 3 REV DATE: 2019-10-21 PART NUMBER: Polymer PTC Devices Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21-50968309 Fax: 86-21-50968310 Surface mount fuses E-mail: market@way-on.com LP-SM250 Http://www.way-on.com Features  Fast tripping resettable circuit protection  Normal working temperature ...
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Внешний вид серии LP-SM(L)

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DOCUMENT: M20088 REV LETTER: H PAGE NO: 1 OF 3 REV DATE: 2019-10-21 PART NUMBER: Polymer PTC Devices Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21-50968309 Fax: 86-21-50968310 Surface mount fuses E-mail: market@way-on.com LP-SM250 Http://www.way-on.com Features  Fast tripping resettable circuit protection  Normal working temperature ： -40℃~85℃  Lead-free, halogen-free and compliant with the European Union RoHS Directive 2011/65/EU  Surface mount packaging for automated assembly  Agency Recognition: UL、CSA、TUV Product Dimensions (mm) A Max 9.50 Part number LP-SM250 B Max 3.00 C Max 6.71 D Min 0.50 Part marking Electrical Characteristics Part number LP-SM250 IH IT Vmax Imax Ttrip Pd typ Rmin R1max (A) (A) (V) (A) Current(A) Time(S) (W) (Ω) (Ω) 2.50 5.00 15 40 8.0 25.00 1.9 0.025 0.085 IH=Hold current: maximum current at which the device will not trip at 25℃ still air. IT=Trip current: minimum current at which the device will always trip at 25℃ still air. Vmax=Maximum voltage device can withstand without damage at rated current. Imax=Maximum fault current device can withstand without damage at rated voltage. Ttrip=Maximum time to trip(s) at assigned current. Pdtyp=Typical power dissipation: typical amount of power dissipated by the device when in state air environment. Rmin=Minimum device resistance at 25℃ prior to tripping. R1max=Maximum device resistance measured in the nontripped state 1 hour post reflow. Thermal Derating Part number -40℃ 3.99 LP-SM250 -20℃ 3.54 0℃ 3.06 Maximum Ambient Temperature 25℃ 40℃ 50℃ 2.50 2.18 1.92 60℃ 1.68 70℃ 1.41 85℃ 1.00 Solder Reflow Recommendations C Solder Pad Layouts Part number B A B LP-SM250 A B C (mm) (mm) (mm) 6.10 2.30 4.60 * Recommended reflow methods: IR, Vapor phase oven, hot air oven solder. * Devices can be cleaned using standard industry methods and solvents. Notes: If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. Package Information Tape & Reel: 1500pcs per reel. Specifications are subject to change without notice. Page 1 of 3 PDF
Документация на LP-SM250 

Shang Hai Wayon Thermo-Electro

Дата модификации: 23.10.2022

Размер: 304.3 Кб

3 стр.

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