LP-SM260C

WAYON
DOCUMENT: M20687 REV LETTER: B PAGE NO: 1 OF 2 DATE: 2020-07-28 PART NUMBER： LP-SM260C Polymer PTC Devices Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21-50968308 Fax: 86-21-50968310 Surface mount fuses E-mail: market@way-on.com Http://www.way-on.com Features  Small size of 2920, Normal working temperature with -40℃~85℃  Lead-free an...
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DOCUMENT: M20687 REV LETTER: B PAGE NO: 1 OF 2 DATE: 2020-07-28 PART NUMBER： LP-SM260C Polymer PTC Devices Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21-50968308 Fax: 86-21-50968310 Surface mount fuses E-mail: market@way-on.com Http://www.way-on.com Features  Small size of 2920, Normal working temperature with -40℃~85℃  Lead-free and compliant with the European Union RoHS Directive 2011/65/EU  Fast tripping resettable circuit protection  Surface mount packaging for automated assembly  Agency Recognition: UL、TUV Product Dimensions (mm) Part number LP-SM260C A B C D E Typ. Typ. Typ. Typ. Typ. 7.70±0.28 5.24±0.20 1.00±0.50 1.30±0.50 0.60±0.30 Electrical Characteristics Part number LP-SM260C IH IT Vmax Imax Ttrip (A) (A) (V) (A) Current(A) 2.60 5.20 6 40 8.0 Pd typ Rmin R1max Time(S) (W) (Ω) (Ω) 20.00 1.9 0.015 0.075 IH=Hold current: maximum current at which the device will not trip at 25℃ still air. IT=Trip current: minimum current at which the device will always trip at 25℃ still air. Vmax=Maximum voltage device can withstand without damage at rated current. Imax=Maximum fault current device can withstand without damage at rated voltage. Ttrip=Maximum time to trip(s) at assigned current. Pdtyp=Typical power dissipation: typical amount of power dissipated by the device when in state air environment. Rmin=Minimum device resistance at 25℃ prior to tripping. R1max=Maximum device resistance measured in the nontripped state 1 hour post reflow. Thermal Derating Maximum ambient operating temperature(℃) LP-SM260C -40 -20 0 20 25 40 50 60 70 85 Hold Current (A) 4.15 3.65 3.18 2.64 2.60 2.24 1.91 1.77 1.46 1.01 Trip Current (A) 8.30 7.30 6.36 5.28 5.20 4.48 3.82 3.54 2.92 2.02 Solder Reflow Recommendations C Solder Pad Layouts B A B A B C (mm) (mm) (mm) LP-SM260C 4.60 2.00 5.30 * Recommended reflow methods: IR, Vapor phase, hot air oven. * Devices can be cleaned using standard industry methods and solvents. Notes:  If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.  Devices are not designed to be wave soldered to the bottom side of the board. Part number Package Information Tape & Reel: 4000pcs per reel. Effectivity: Reference documents shall be the issue in effect on the date of invitation for bid. Caution: Operation beyond the rated voltage or current may result in rupture electrical arcing or flame. Specifications are subject to change without notice page 1 of 1 PDF
Документация на LP-SM260C 

Shang Hai Wayon Thermo-Electro

Дата модификации: 01.08.2022

Размер: 222.6 Кб

2 стр.

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