LP-SM300C/16

DOCUMENT: M20079 REV LETTER: I PAGE NO: 1 OF 2 DATE: 2020-01-19 PART NUMBER: LP-SM300C/16 Polymer PTC Devices Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21-50968308 Fax: 86-21-50968310 E-mail: market@way-on.com Surface mount fuses Http://www.way-on.com Features  Small size of 2920  F ast tripping resettable circuit protection  Lea...
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DOCUMENT: M20079 REV LETTER: I PAGE NO: 1 OF 2 DATE: 2020-01-19 PART NUMBER: LP-SM300C/16 Polymer PTC Devices Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21-50968308 Fax: 86-21-50968310 E-mail: market@way-on.com Surface mount fuses Http://www.way-on.com Features  Small size of 2920  F ast tripping resettable circuit protection  Lead-free and compliant with the European Union RoHS Directive 2011/65/EU  Surface mount packaging for automated assembly Product Dimensions (mm) Part number LP-SM300C/16 A B C D E Typ. Typ. Typ. Typ. Typ. 7.58±0.40 5.04±0.40 1.00±0.40 1.30±0.40 0.60±0.30 Part marking SM 300 Electrical Characteristics Part number LP-SM300C/16 IH IT Vmax Imax Ttrip (A) (A) (V) (A) Current(A) 3.00 6.00 16 40 8.0 Pd typ Rmin R1max Time(S) (W) (Ω) (Ω) 35.00 1.9 0.015 0.048 IH=Hold current: maximum current at which the device will not trip at 25℃ still air. IT=Trip current: minimum current at which the device will always trip at 25℃ still air. Vmax=Maximum voltage device can withstand without damage at rated current. Imax=Maximum fault current device can withstand without damage at rated voltage. Ttrip=Maximum time to trip(s) at assigned current. Pdtyp=Typical power dissipation: typical amount of power dissipated by the device when in state air environment. Rmin=Minimum device resistance at 25℃ prior to tripping. R1max=Maximum device resistance measured in the nontripped state 1 hour post reflow. Thermal Derating Maximum ambient operating temperature(℃) LP-SM300C/16 -40 -20 0 20 25 40 50 60 70 85 Hold Current (A) 4.76 4.21 3.66 3.05 3.00 2.61 2.21 2.05 1.69 1.17 Trip Current (A) 9.15 8.06 7.32 6.10 6.00 5.22 4.42 4.10 3.24 2.08 Solder Reflow Recommendations C Solder Pad Layouts Part number LP-SM300C/16 B A B A B C (mm) (mm) (mm) 4.60 2.00 5.30 * Recommended reflow methods: IR, Vapor phase oven, hot air oven solder. * Devices can be cleaned using standard industry methods and solvents. Notes: If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. Package Information Tape & Reel: 6000pcs per reel. Specifications are subject to change without notice Page 1 of 1 PDF
Документация на LP-SM300C/16 

Shang Hai Wayon Thermo-Electro

Дата модификации: 01.08.2022

Размер: 209.2 Кб

2 стр.

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