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LP-SM300C/24

WAYON
DOCUMENT: M20073 REV LETTER: K PAGE NO: 1 OF 2 DATE: 2019-09-05 PART NUMBER： Polymer PTC Devices Wayon Electronics Co., Ltd. 1001 Shiwan 7th Road, Shanghai, 201207 P.R. China Tel: 86-21-50968309 Fax: 86-21-50968310 E-mail: market@way-on.com Surface mount fuses Http://www.way-on.com LP-SM300C/24 Features  Fast tripping resettable circuit protection  Lead-free and compliant with the E...
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Внешний вид серии LP-SM(L)

Технические характеристики

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Ток удержания
Ток срабатывания
Рабочий ток (max)
Рабочее напряжение (max)
Рабочее сопротивление
Время срабатывания
Корпус
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Аналоги 1

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Тип Наименование Корпус Упаковка i I удерж. I сраб. I макс U макс R Время Особенности Корпус Примечания T раб Карточка
товара
P= FSMD300-24-2920R (FUZETEC)
 
SMD292074X51MM в ленте 2000 шт
 
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Файлы 1

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DOCUMENT: M20073 REV LETTER: K PAGE NO: 1 OF 2 DATE: 2019-09-05 PART NUMBER： Polymer PTC Devices Wayon Electronics Co., Ltd. 1001 Shiwan 7th Road, Shanghai, 201207 P.R. China Tel: 86-21-50968309 Fax: 86-21-50968310 E-mail: market@way-on.com Surface mount fuses Http://www.way-on.com LP-SM300C/24 Features  Fast tripping resettable circuit protection  Lead-free and compliant with the European Union RoHS Directive 2011/65/EU  Surface mount packaging for automated assembly Product Dimensions (mm) Part number LP-SM300C/24 A B C D E Max Max Max Min Min 7.98 5.44 1.50 0.80 0.30 Part marking SM 300 Electrical Characteristics Part number LP-SM300C/24 IH IT Vmax Imax Pd typ Rmin R1max (A) (A) (V) (A) Current(A) Ttrip Time(S) (W) (Ω) (Ω) 3.00 6.00 24 40 8.0 35.00 1.9 0.015 0.048 IH=Hold current: maximum current at which the device will not trip at 25℃ still air. IT=Trip current: minimum current at which the device will always trip at 25℃ still air. Vmax=Maximum voltage device can withstand without damage at rated current. Imax=Maximum fault current device can withstand without damage at rated voltage. Ttrip=Maximum time to trip(s) at assigned current. Pdtyp=Typical power dissipation: typical amount of power dissipated by the device when in state air environment. Rmin=Minimum device resistance at 25℃ prior to tripping. R1max=Maximum device resistance measured in the nontripped state 1 hour post reflow. Thermal Derating Maximum ambient operating temperature(℃) LP-SM300C/24 -40 -20 0 20 25 40 50 60 70 85 Hold Current (A) 4.76 4.21 3.66 3.05 3.00 2.61 2.21 2.05 1.69 1.17 Trip Current (A) 9.15 8.06 7.32 6.10 6.00 5.22 4.42 4.10 3.24 2.08 Solder Reflow Recommendations A B C (mm) (mm) (mm) 4.60 2.00 5.30 C Part number LP-SM300C/24 B A B * Recommended reflow methods: IR, Vapor phase oven, hot air oven solder. * Devices can be cleaned using standard industry methods and solvents. Notes: If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. Package Information Tape & Reel: 6000pcs per reel. Effectivity: Reference documents shall be the issue in effect on the date of invitation for bid. Caution: Operation beyond the rated voltage or current may result in rupture electrical arcing or flame. Solder Pad Layouts Specifications are subject to change without notice. Page 1 of 2 PDF
Документация на LP-SM300C/24 

Shang Hai Wayon Thermo-Electro

Дата модификации: 16.11.2022

Размер: 215 Кб

2 стр.

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