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LP-SM400C/16

WAYON
DOCUMENT: M20083 REV LETTER: H PAGE NO: 1 OF 2 DATE: 2019-09-05 PART NUMBER： LP-SM400C/16 Polymer PTC Devices Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21-50968309 Fax: 86-21-50968310 Surface mount fuses Http://www.way-on.com E-mail: market@way-on.com Features  Fast tripping resettable circuit protection  Lead-free and compliant wi...
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DOCUMENT: M20083 REV LETTER: H PAGE NO: 1 OF 2 DATE: 2019-09-05 PART NUMBER： LP-SM400C/16 Polymer PTC Devices Wayon Electronics Co., Ltd. No.1001,Shiwan 7th Road,Pudong,Shanghai 201202,P.R.China Tel: 86-21-50968309 Fax: 86-21-50968310 Surface mount fuses Http://www.way-on.com E-mail: market@way-on.com Features  Fast tripping resettable circuit protection  Lead-free and compliant with the European Union RoHS Directive 2011/65/EU  Surface mount packaging for automated assembly Product Dimensions (mm) Part number LP-SM400C/16 A B C D E Max Max Max Min Min 7.98 5.44 2.00 0.80 0.30 Part marking SM 400 Electrical Characteristics Part number LP-SM400C/16 IH IT Vmax Imax Ttrip (A) (A) (V) (A) Current(A) 4.00 8.00 16 40 8.0 Pd typ Rmin R1max Time(S) (W) (Ω) (Ω) 40.00 1.9 0.012 0.040 IH=Hold current: maximum current at which the device will not trip at 25℃ still air. IT=Trip current: minimum current at which the device will always trip at 25℃ still air. Vmax=Maximum voltage device can withstand without damage at rated current. Imax=Maximum fault current device can withstand without damage at rated voltage. Ttrip=Maximum time to trip(s) at assigned current. Pdtyp=Typical power dissipation: typical amount of power dissipated by the device when in state air environment. Rmin=Minimum device resistance at 25℃ prior to tripping. R1max=Maximum device resistance measured in the nontripped state 1 hour post reflow. Thermal Derating Maximum ambient operating temperature(℃) LP-SM400C/16 -40 -20 0 25 40 50 60 70 85 Hold Current (A) 6.35 5.63 4.86 4.00 3.46 2.95 2.72 2.24 1.53 Trip Current (A) 12.70 11.26 9.72 8.00 6.92 5.90 5.44 4.48 3.06 Solder Reflow Recommendations C Solder Pad Layouts Part number LP-SM400C/16 B A B A B C (mm) (mm) (mm) 4.60 2.00 5.30 * Recommended reflow methods: IR, Vapor phase oven, hot air oven solder. * Devices can be cleaned using standard industry methods and solvents. Notes: If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. Package Information Tape & Reel: 6000pcs per reel. Specifications are subject to change without notice. Page 1 of 2 PDF
Документация на LP-SM400C/16 

Shang Hai Wayon Thermo-Electro

Дата модификации: 02.11.2022

Размер: 214.9 Кб

2 стр.

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