IRFH9310TRPBF-VB

VBSemi
IRFH9310TRPBF www.VBsemi.com P-Channel 30-V (D-S) MOSFET FEATURES PRODUCT SUMMARY VDS (V) - 30 RDS(on) (Ω) ID (A) 0.0032 at VGS = - 10 V - 100 0.0050 at VGS = - 4.5 V - 80 • Halogen-free • TrenchFET® Power MOSFET • 100 % Rg Tested Qg (Typ.) 78 nC RoHS COMPLIANT APPLICATIONS • Notebook - Load Switch S DFN5X6 Top View Top View Bottom View 1 8 2 7 3 6 4 5 G PIN1 D P-Channel...
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  • Корпус: —
  • Норма упаковки: 20  шт.

Аналоги 6

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IRFH9310TRPBF www.VBsemi.com P-Channel 30-V (D-S) MOSFET FEATURES PRODUCT SUMMARY VDS (V) - 30 RDS(on) (Ω) ID (A) 0.0032 at VGS = - 10 V - 100 0.0050 at VGS = - 4.5 V - 80 • Halogen-free • TrenchFET® Power MOSFET • 100 % Rg Tested Qg (Typ.) 78 nC RoHS COMPLIANT APPLICATIONS • Notebook - Load Switch S DFN5X6 Top View Top View Bottom View 1 8 2 7 3 6 4 5 G PIN1 D P-Channel MOSFET ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted Parameter Drain-Source Voltage Gate-Source Voltage Symbol VDS VGS Continuous Drain Current (TJ = 150 °C) TC = 25 °C TC = 70 °C TA = 25 °C TA = 70 °C Limit - 30 ± 20 ID Continuous Source-Drain Diode Current TC = 25 °C TA = 25 °C IS Single Pulse Avalanche Current Single Pulse Avalanche Energy L = 0.1 mH IAS EAS Maximum Power Dissipation TC = 25 °C TC = 70 °C TA = 25 °C TA = 70 °C PD TJ, Tstg Operating Junction and Storage Temperature Range Soldering Recommendations (Peak Temperature)d, e V - 100 - 75 - 31.6b, c - 25.3b, c - 300 IDM Pulsed Drain Current Unit - 60a - 5.6b, c - 40 80 104 66.6 6.25b, c 4.0b, c - 55 to 150 260 A mJ W °C THERMAL RESISTANCE RATINGS Parameter b, f Maximum Junction-to-Ambient Maximum Junction-to-Case (Drain) t ≤ 10 s Steady State Symbol RthJA RthJC Typical 15 0.9 Maximum 20 1.2 Unit °C/W Notes: a. Package limited. b. Surface Mounted on 1" x 1" FR4 board. c. t = 10 s. d. The DFN5x6 is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection. e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components. f. Maximum under Steady State conditions is 54 °C/W. 1 PDF
Документация на IRFH9310TRPBF-VB 

Дата модификации: 10.02.2023

Размер: 356.2 Кб

9 стр.

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